애플리케이션
Package-On-Package Assembly
Package-on-package (PoP) assembly stacks silicon chips to maximize component density, making it ideal for compact devices like smartphones. Indium Corporation offers specialized expertise in PoP process technology, along with proven solder pastes and fluxes, to optimize motherboard space—enabling more powerful and energy-efficient devices.
개요
PoP Assembly for Enhanced Electronics Manufacturing
With PoP, manufacturers can shrink the footprint of integrated circuits on a device’s motherboard, optimizing space for more powerful or energy-efficient devices. The process typically consists of printing solder paste on the substrate, placing the logic chip, dipping the memory package in PoP flux or solder paste, and reflowing the assembly. Indium Corporation’s PoP materials are designed for maximum flux or paste transfer to component bumps while ensuring volume consistency.
혜택
High-Performance Materials for Efficient PoP Assembly
Top Precision
Our materials are engineered with ideal viscosity and rheology to ensure maximum transfer to component bumps while maintaining consistent volume.
높은 수익률
Advanced flux technology contributes to higher end-of-line yields by reducing defects and enhancing overall assembly quality.
Improved Wetting and Solderability
Excellent wettability and solderability are crucial for creating strong and reliable solder joints, ensuring the mechanical reliability and electrical performance of the assembled package.
Application Flexibility
Materials can be applied by dipping or dispensing, offering versatility in the assembly process and significant equipment cost savings by not requiring precise control of flux volume and reflow.
Package-on-Package Products
Indium Corporation’s PoP materials are crafted with optimal viscosity, advanced flux technology, and excellent wettability. They offer high yields and application flexibility, ensuring precision and reliability with strong solder joints.
패키지 온 패키지 플럭스
Package-on-Package flux for high yields and optimal…
PCB 어셈블리 솔더 페이스트
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PCB 어셈블리 플럭스
PCBA Fluxes include wave, rework, and package-on-package…
관련 시장
PoP technology is trusted across key markets for to its ability to enhance device performance while saving space.
고객의 성공
우리의 목표
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