선택적 납땜

스프레이 플럭싱은 오늘날 인쇄회로기판에 플럭스를 도포하는 가장 일반적인 방법입니다. 스프레이 플럭싱 장비가 처음 개발되었을 당시에는 투박하고 비효율적인 기계였습니다. 작업 현장이 지저분해지기 쉬웠고 많은 양의

특정 회로 기판이나 전체 생산 공정에 필요한 솔더 페이스트의 정확한 양을 계산하는 것은 다음과 같은 여러 가지 이유로 어려울 수 있습니다. 인쇄 도포량의 편차, 기판에 남아 있는 페이스트 등

It is not often that we get a request for SIR (Surface Insulation Resistance) and/or ECM (Electro-Chemical Migration) results for a water washable/soluble flux or solder paste, but often enough to

Folks, Patty and Rob return from their honeymoon……. Patty had just finished some emails and was ready to head off to meet Rob and some of their buddies for

Shelf life of solder is a concern that is raised by customers on a somewhat regular basis. Solder pastes typically have a well defined shelf life, however the useable life of a solid form of solder

A colleague in California was on the phone last week: "We need a flux with greater activity!" He said. Choking down comments like "Maybe we can take it jogging next time you're in

Folks, In teaching process optimization and failure analysis, one of the most helpful concepts is understanding he difference between common cause and special cause defects. A special cause defect,

Figure 1: Solderspatter (soldersplash) on Gold/Nickel Figure 2: Phase Inversion during Reflow Most people are aware that solder paste is a mixture of solder powder and a flux

Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing "tombstoning" of passives at a major electronic