제품
포름산 납땜 기술(FAST)
Vacuum reflow soldering with formic acid (HCOOH) has emerged as an ideal reflow method for power device packaging. The ability to achieve clean, ultra-low voiding solder interconnections without the use of a flux means that no cleaning step is needed post reflow. Under Formic Acid Soldering Technologies (FAST) suite, Indium Corporation® has developed both proven and new specialized materials for this process, providing cutting-edge materials for advanced power device assemblies, provide a selection to meet your specific needs.
Indium Corporation 제공
- Wide selection of alloys
- Specialized preform solder
- Fluxless paste
Formic Acid Soldering Technologies (FAST) Products
FAST Paste
Flux-less paste specially developed for formic acid reflow. The traditional flux vehicle containing rosins, activators and other additives that result in residue after reflow are replaced by a solvent binder system, eliminating the need for cleaning after reflow.
Preform Solder
High-quality preform solder available in a wide range of alloy choices. Stringent manufacturing processes and quality control ensure these engineered solders are ideal for flux-free reflow soldering with formic acid. Included in the product family are the high-reliability, bond-line control InFORMS®
Tacking Agent
We also provide the complementary flux-free tacking agent InTACK®, reducing the need for fixtures during reflow.
요약 정보
Low-voiding solder joints ensure that optimal thermal dissipation is achieved during device operation. This is especially important for high power density devices that are under high operating temperatures conditions constantly. By eliminating the volatile flux chemicals and utilizing vacuum soldering with formic acid, ultra-low voiding can be achieved with this technology and Indium Corporation’s FAST product suite.
SPecs
FAST (Formic Acid Soldering Technologies) Products
FAST (Formic Acid Soldering Technologies) products offer more choice and flexibility with material selection in power device assemblies. Applications include power discrete packaging, die-on-leadframe and clip-attach, and power module assembly, die-on-substrate, substrate-attach, pin soldering, NTC-attach and clip-attach.
| 제품 | Alloy Choice | 애플리케이션 | 세부 정보 |
|---|---|---|---|
| FAST Paste | Pb-free and High-Pb | Printing and dispensing | Flux-free solder paste |
| FAST Preforms | Pb-free and High-Pb | Pick-and-place | Pre-cut solder preforms |
| InFORMS® | Pb-free and High-Pb | Pick-and-place | Pre-cut InFORMS® for BLT control |
| Ribbon | Pb-free and High-Pb | Ribbon cut and pick-and-place | Ribbon solder for both preforms and InFORMS® |
| InTACK® | N/A | Dispensing | Flux-free tacking agent |
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