選択的はんだ付け

スプレーフラックス処理は、現在、プリント基板にフラックスを塗布する最も一般的な方法です。スプレーフラックス装置が最初に開発された当初は、扱いにくく、非効率的な機械でした。作業現場は汚くなり、多くの

特定の回路基板や量産ロット全体に必要なはんだペーストの正確な量を算出することは、以下の理由などにより困難な場合があります。具体的には、印刷量のばらつきや、基板上に残留したペーストなどが挙げられます。

It is not often that we get a request for SIR (Surface Insulation Resistance) and/or ECM (Electro-Chemical Migration) results for a water washable/soluble flux or solder paste, but often enough to

Folks, Patty and Rob return from their honeymoon……. Patty had just finished some emails and was ready to head off to meet Rob and some of their buddies for

Shelf life of solder is a concern that is raised by customers on a somewhat regular basis. Solder pastes typically have a well defined shelf life, however the useable life of a solid form of solder

A colleague in California was on the phone last week: "We need a flux with greater activity!" He said. Choking down comments like "Maybe we can take it jogging next time you're in

Folks, In teaching process optimization and failure analysis, one of the most helpful concepts is understanding he difference between common cause and special cause defects. A special cause defect,

Figure 1: Solderspatter (soldersplash) on Gold/Nickel Figure 2: Phase Inversion during Reflow Most people are aware that solder paste is a mixture of solder powder and a flux

Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing "tombstoning" of passives at a major electronic