PCBアセンブリはんだペースト

SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post in a series on the stencil printing aspect of SMT

Part 5: Solder Mask Defined vs. Copper Defined (Non-Solder Mask Defined) Pads Figure

Folks, Our discussion of Weibull Analysis continues…..Let’s say you have worked hard and assembled some SMT lead-free PCBs for thermal cycle testing. You used the best lead-free solder paste,

Folks, In continuing our discussion on Weibull Analysis, let’s assume we assembled some SMT and through-hole PCBs with lead-free solder paste. On this board are also some bottom-side terminated

Tombstoning (also known as the Manhattan effect, drawbridge effect, or Stonehenge effect) is described (in the simplest, and most common, sense) as occurring when one end of a passive device, such as

I was asked this week to contribute to the upcoming IPC handbook (IPC-CH-65 HDBK) on the section on contamination and its effects on printed wiring assemblies (PWA’s). There is a clear crossover of

I have previously discussed various reasons why thermal considerations in a device cannot be an afterthought.There are various methods for handling the thermal needs of a device before it becomes a

今週のトピックは、ソルダーペーストを使用したウェーハバンピングと基板バンピングの両方と、パウダーの問題である。

私のチームは先日、IEEE Spectrumの興味深い記事を目にした。