BGAボール・アタッチ

The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the

Derivation of the Weibull Graph Folks, Last time we introduced Weibull analysis. Let's now derive the relationships needed to calculate the slope, beta, and characteristic life, eta. F(t) is the

インジウム・コーポレーションは何年も前からはんだボールを製造しており、「はんだボールを作るために必要なことは何でもする」という評判を得ている。

I recently visited a customer to help optimize a flux-less indium soldering application. They admitted they needed flux but didn’t know 1) what to use, or 2) if there was a better way to fix

This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or

Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are

Patty had to admit that the last few weeks were exciting. Her talk to US Army Rangers and Navy Seals on critical thinking went really well. Now, the local newspaper was asking her to comment on

Phil Zarrow: This video is for those in the electronics assembly industry that want to minimize the head-in-pillow defect. It includes the solder paste properties that help overcome this challenge.

皆さん、パティとロブがまた冒険に出たようです。ちょっと覗いてみよう......。パティは大学時代から同じ2001年式のサーブ・ステーションワゴンに乗っていた。それは素晴らしい車だった。