プレスリリース

2026年6月3日、ニューヨーク州クリントン発 — インジウム・コーポレーション®とエイムズ国立研究所は、重要な材料であるガリウムの米国国内生産を拡大するための研究開発提携を発表した。

2026年6月1日、ニューヨーク州クリントン発 — Indium Corporation®のシニア・エリア・テクニカル・マネージャー、レオ・フー氏は、先進的な金属熱界面材料（TIM）がどのようにして新たな性能水準を達成できるかについて、

2026年5月29日、ニューヨーク州クリントン発 – 重要なRF/マイクロ波用途向けの革新的な材料ソリューションにおける業界リーダーであるインジウム・コーポレーション®は、高信頼性の金系

ニューヨーク州クリントン、2026年5月xx日 – あらゆるパワーエレクトロニクスデバイス向けの高信頼性材料のリーディングプロバイダーであるインジウム・コーポレーション®は、PCIMにおいて、AI活用を可能にする製品ポートフォリオを展示する予定です。

2026年5月26日、ニューヨーク州クリントン発 — パワーエレクトロニクス機器向けの高信頼性はんだ、焼結材、および熱界面材料の主要プロバイダーであるインジウム・コーポレーション®は、3つの製品を展示する予定です。

CLINTON, N.Y., May 21, 2026 – As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will showcase its high-reliability portfolio of

CLINTON, N.Y., May 15, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how metal thermal interface materials (TIMs) can unlock the full performance potential of

CLINTON, N.Y., May 13, 2026 — Indium Corporation® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder

CLINTON, N.Y., May 12, 2026 — As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge

CLINTON, N.Y., May 1, 2026 — As a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product

CLINTON, N.Y., April 30, 2026 — As a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical

CLINTON, N.Y., April 27, 2026 — Indium Corporation today announced it has been awarded a $3.2 million grant by the

CLINTON, N.Y., April 23, 2026 — Indium Corporation® today announced that it has joined the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a national initiative supporting

CLINTON, N.Y., April 14, 2026 — Indium Corporation® Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics

CLINTON, N.Y., April 6, 2026 — Indium Corporation®, a leading materials provider for the electronics assembly market, recently received Electronics Manufacturing (EM) Asia Innovation Awards for

CLINTON, N.Y., April 3, 2026 — Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, announced that it has executed a

CLINTON, N.Y., March 31, 2026 – As a leading materials provider to the electric vehicle (EV) and e-mobility industries—addressing power module- and PCBA-level applications—Indium Corporation®

CLINTON, N.Y., March 23, 2026 — Indium Corporation® received a Circuits Assembly New Product Introduction (NPI) Award for Indium12.9HF, a halogen-free solder paste engineered for cost-effective,

CLINTON, N.Y., March 19, 2026 — As a proven leader in soldering materials and metal thermal interface materials (TIMs) solutions for future-forward technologies, Indium Corporation® will showcase

CLINTON, N.Y., March 19, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor

CLINTON, N.Y., March 18, 2026 — Indium Corporation® Product Manager – Semiconductor Dean Payne will present copper sinter paste solutions that deliver high thermal and reliability performance,