プレスリリース

以下のプレスリリースは、インジウム・コーポレーション®との提携に関して、2026年10月20日にマイクロン・テクノロジー社が発表したものです。許可を得てここに再掲載します。元の見出し：マイクロン

2026年10月15日、ニューヨーク州クリントン発 — 半導体パッケージングおよび電子機器組立向けの革新的な材料ソリューションを提供する業界のリーダーであるインジウム・コーポレーション®は、メキシコ・テクノロジー・アワードを受賞しました。

2026年10月9日、ニューヨーク州クリントン発 — インジウム・コーポレーション®の地域テクニカルマネージャー兼アドバンスト・アプリケーション担当技術者であるアンドレアス・カーチ氏が、業界標準の策定に向けた自身の取り組みについて講演を行います。

クリントン、

2026年9月24日、ニューヨーク州クリントン発 — インジウム・コーポレーション®のエンジニアード・ソルダー・マテリアルズ（ESM）部門シニア・アプリケーション開発エンジニア、ライアン・メイベリー氏が、ギ酸はんだ付けとその普及について講演する

CLINTON, N.Y., October 2, 2026 — Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with

CLINTON, N.Y., September 28, 2026 – As an industry leader in innovative materials solutions for electronics packaging, Indium Corporation® will showcase its high-reliability solder pastes for

CLINTON, N.Y., September 25, 2026 – Indium Corporation, a leading materials manufacturer and supplier to the global electronics, semiconductor, and thermal management markets, will feature a

CLINTON, N.Y., September 25, 2026 — As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on addressing

CLINTON, N.Y., September 10, 2026 — Indium Corporation is pleased to announce the promotion of Chris Bastecki to Business Unit Vice President, Americas Sales & Service and Global Printed

to Research and Development Director CLINTON, N.Y., September 3, 2026 — Indium Corporation has promoted Hongwen Zhang, Ph.D., to Research and Development (R&D) Director. In this role, he will

TAIPEI, Taiwan, September 2, 2026 — As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge

CLINTON, N.Y., September 1, 2026 — With a team of manufacturing and technical experts supporting customers across India, Indium Corporation will feature its portfolio of high-performance

CLINTON, N.Y., August 31, 2026 — Indium Corporation® Senior Area Technical Manager Luis Pan will discuss how precisely matching materials and assembly processes can positively impact yield and

CLINTON, N.Y., August 28, 2026 — Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges

CLINTON, N.Y., August 24, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and

CLINTON, N.Y., August 21, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging

CLINTON, N.Y., August 20, 2026 – As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability

CLINTON, N.Y., August 11, 2026 — Innovation begins with people and—for the 14th consecutive year—Indium Corporation’s award-winning summer internship program has cultivated the next

CLINTON, N.Y., August 11, 2026 — Indium Corporation, a leading provider of innovative materials solutions for electronics assembly, semiconductor packaging, and thermal management applications,

CLINTON, N.Y., July 30, 2026 — As a leading provider of high-reliability soldering and sintering materials for power electronics devices, Indium Corporation experts will share new research and