Comunicados de prensa

CLINTON, N.Y., March 12, 2026 — Indium Corporation® will showcase its proven solder solutions through live demonstrations at APEX Expo 2026,  March 17-19, in

CLINTON, N.Y., March 11, 2026 — As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge

CLINTON, N.Y., March 3, 2026 — Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at APEX EXPO 2026, March

CLINTON, N.Y., February 27, 2026 — Indium Corporation® will highlight high-reliability liquid metal technology and metal thermal interface material (TIM) products at SEMI-THERM 2026, March 9-12,

With Advanced Materials Solutions at CIPS 2026 CLINTON, N.Y., February 26, 2026 — As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will

CLINTON, N.Y., February 25, 2026 — Indium Corporation® Product Manager, Engineered Solder Materials (ESM), Jim McCoy, will present techniques to minimize oxidation and improve the thermal

CLINTON, N.Y., February 19, 2026 — As one of the leading providers of high-performance thermal management solutions, Indium Corporation® will feature its lineup of metal thermal interface

CLINTON, N.Y., February 17, 2026 — Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2026, taking place March 1-4 in Mesa,

CLINTON, Nueva York, 21 de enero de 2026 — Indium Corporation® presentará sus soluciones de soldadura de oro AuLTRA® MediPro de alta fiabilidad en MD&M West, del 3 al 5 de febrero, en Anaheim, California. AuLTRA®

CLINTON, Nueva York, 15 de enero de 2026. Los expertos de Indium Corporation ofrecerán presentaciones sobre procesos de soldadura y selección de materiales sinterizados en NEPCON Japan 2026. La conferencia, que celebra su 40.º aniversario,

CLINTON, Nueva York, 14 de enero de 2026 — Indium Corporation® presentará su versátil serie InFORCE® de pastas de sinterización a presión en la feria NEPCON Japan 2026, que se celebrará del 21 al 23 de enero en

CLINTON, N.Y., January 14, 2026 — Indium Corporation® will feature its formic acid soldering technologies (FAST) product series at NEPCON Japan 2026, taking place January 21-23, in Tokyo. The

CLINTON, Nueva York, 9 de enero de 2026 — Indium Corporation® presentará sus preformas de alta fiabilidad y precisión para la fijación de chips basadas en oro para aplicaciones láser críticas en SPIE Photonics West, en enero.

CLINTON, NY, January 6, 2026 — Indium Corporation Senior Technologist Ronald Lasky, Ph.D., P.E., will be among the presenters at the SMTA Pan Pacific Strategic Electronics Symposium (Pan Pac)

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of SiPaste® C312HF, a halogen-free, cleanable solder paste formulated

Indium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse® Technology during the IEEE International Conference on

Indium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held

A technical presentation on thermal interface materials (TIMs) will be featured at an upcoming webinar organized by the International Electronics Manufacturing Initiative (INEMI) and hosted by

Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 19-20 in Silicon Valley, California. AuLTRA®

As one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of

As one of the leading providers of high-performance thermal materials solutions, Indium Corporation® is proud to feature its lineup of metal thermal interface materials and other high-reliability