Comunicados de prensa

CLINTON, N.Y., August 24, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and

CLINTON, N.Y., August 21, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging

CLINTON, N.Y., August 20, 2026 – As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability

CLINTON, N.Y., August 11, 2026 — Innovation begins with people and—for the 14th consecutive year—Indium Corporation’s award-winning summer internship program has cultivated the next

CLINTON, N.Y., August 11, 2026 — Indium Corporation, a leading provider of innovative materials solutions for electronics assembly, semiconductor packaging, and thermal management applications,

CLINTON, N.Y., July 30, 2026 — As a leading provider of high-reliability soldering and sintering materials for power electronics devices, Indium Corporation experts will share new research and

CLINTON, N.Y., July 2, 2026 — Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will present research on the use of thermal interface

CLINTON, Nueva York, 3 de junio de 2026 — Indium Corporation® y el Laboratorio Nacional de Ames han anunciado una colaboración en materia de investigación y desarrollo para ampliar la producción estadounidense de galio, un material esencial que se utiliza

CLINTON, Nueva York, 1 de junio de 2026 — Leo Hu, director técnico sénior de área de Indium Corporation®, analizará cómo los materiales avanzados de interfaz térmica metálica (TIM) pueden alcanzar nuevos umbrales de rendimiento en

CLINTON, Nueva York, 29 de mayo de 2026 – Como líder del sector en soluciones innovadoras de materiales para aplicaciones críticas de radiofrecuencia y microondas, Indium Corporation® presentará su producto de alta fiabilidad a base de oro

CLINTON, N.Y., May xx, 2026 – As a leading provider of high-reliability materials for all power electronics devices, Indium Corporation® will showcase its AI-enabling portfolio of products at PCIM

CLINTON, N.Y., May 26, 2026 — Indium Corporation®, a leading provider of high-reliability soldering, sintering, and thermal interface materials for power electronics devices, will feature three

CLINTON, N.Y., May 21, 2026 – As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will showcase its high-reliability portfolio of

CLINTON, Nueva York, 15 de mayo de 2026 — Leo Hu, director técnico sénior de área de Indium Corporation®, analizará cómo los materiales de interfaz térmica metálicos (TIM) pueden aprovechar al máximo el potencial de rendimiento de

CLINTON, N.Y., May 13, 2026 — Indium Corporation® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder

CLINTON, N.Y., May 12, 2026 — As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge

CLINTON, N.Y., May 1, 2026 — As a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product

CLINTON, N.Y., April 30, 2026 — As a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical

CLINTON, N.Y., April 27, 2026 — Indium Corporation today announced it has been awarded a $3.2 million grant by the

CLINTON, N.Y., April 23, 2026 — Indium Corporation® today announced that it has joined the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a national initiative supporting

CLINTON, N.Y., April 14, 2026 — Indium Corporation® Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics