Package-on-Package

Package-on-Package

Features & Benefits

Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used.
Package-on-Package
Indium Corporation offers a variety of products for PoP assembly.
  • Indium9.88HF PoP Solder Paste
  • PoP Flux 23LV
  • PoP Flux 30B
  • PoP Flux 8.9HF-LV
  • PoP Flux 89-LV