Applications
Package-On-Package Assembly
Package-on-package (PoP) assembly stacks silicon chips to maximize component density, making it ideal for compact devices like smartphones. Indium Corporation offers specialized expertise in PoP process technology, along with proven solder pastes and fluxes, to optimize motherboard space—enabling more powerful and energy-efficient devices.
Overview
PoP Assembly for Enhanced Electronics Manufacturing
With PoP, manufacturers can shrink the footprint of integrated circuits on a device’s motherboard, optimizing space for more powerful or energy-efficient devices. The process typically consists of printing solder paste on the substrate, placing the logic chip, dipping the memory package in PoP flux or solder paste, and reflowing the assembly. Indium Corporation’s PoP materials are designed for maximum flux or paste transfer to component bumps while ensuring volume consistency.
Benefits
High-Performance Materials for Efficient PoP Assembly
Top Precision
Our materials are engineered with ideal viscosity and rheology to ensure maximum transfer to component bumps while maintaining consistent volume.
High Yield
Advanced flux technology contributes to higher end-of-line yields by reducing defects and enhancing overall assembly quality.
Improved Wetting and Solderability
Excellent wettability and solderability are crucial for creating strong and reliable solder joints, ensuring the mechanical reliability and electrical performance of the assembled package.
Application Flexibility
Materials can be applied by dipping or dispensing, offering versatility in the assembly process and significant equipment cost savings by not requiring precise control of flux volume and reflow.
Package-on-Package Products
Indium Corporation’s PoP materials are crafted with optimal viscosity, advanced flux technology, and excellent wettability. They offer high yields and application flexibility, ensuring precision and reliability with strong solder joints.
Package-on-Package Flux
Package-on-Package flux for high yields and optimal
PCB Assembly Solder Pastes
Wide range of PCBA solder pastes to eliminate
PCB Assembly Fluxes
PCBA Fluxes include wave, rework, and package-on-package
Related Markets
PoP technology is trusted across key markets for to its ability to enhance device performance while saving space.
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Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.