Applications
Die-Attach
Die-attach involves securing semiconductor dies—typically Si, SiC, GaAs, or GaN—to a leadframe or substrate. This step is essential in establishing a mechanically reliable interconnection while also ensuring that the thermal and electrical properties meet the application’s requirements. The levels of reliability, thermal conductivity, and electrical conductivity vary across applications, highlighting the importance of selecting the most suitable die-attach material. As a trusted partner in optimizing existing processes and developing innovative solutions, Indium Corporation offers a wide range of die-attach solutions from solder paste, specialty preforms to sinter materials.
Overview
Revolutionizing Semiconductor Die-Attach Materials for High-Power Devices
Die-attach for high-power devices, such as IGBTs and emerging wide bandgap semiconductors, face increasing challenges related to service temperature, power density, and reliability. Traditional high-lead solder materials are reaching their performance limits, but we have developed—and continue to innovate— advanced lead-free semiconductor die-attach materials to overcome current and future challenges.
Benefits
Low Voiding
Our die-attach solutions offer exceptional performance in reducing voids, guaranteeing optimal thermal performance for the application.
Customization
We work closely with our customers and partners to provide tailored soldering solutions for die-attach applications that meet their specific requirements.
High-Reliability Alloys
We offer a wide range of dependable alloys for solder pastes and preforms that meet or surpass industry standards.
Technical Expertise
With profound knowledge and extensive experience in die attach and related materials, our global team of technical experts is ready to offer valuable guidance and support for your project.
Choose the Right Materials for Die-Attach Semiconductor Applications
You can choose from a variety of materials for die-attach processes, including high-temperature solder pastes and gold-based solders. Each option offers distinct advantages and trade-offs, requiring careful evaluation based on the specific application requirements. We offer a range of proven products and solutions to help our customers make the best choice for their needs.
Gold-based Solders
These materials are ideal for costly high-reliability applications, such as aerospace and military, where excellent thermal and electrical conductivity is required.
Sintering
Typically used in high-performance applications, sintering provides excellent thermal and electrical conductivity together with enhanced reliability and durability, making it the ideal choice for WBG semiconductors in power electronics.
High-Temperature Solder Paste
Commonly used in die-on-leadframe applications, solder die attach serves as the mechanical bond between the die and leadframe while also aiding heat dissipation. Paste flux options range from traditional rosin based to ultra-low residue. Alloys include Pb-based, low alpha Pb-based and innovative Pb-free solutions like Durafuse®HT.
Preforms
These products are suitable for applications that require precise material control, such as automated manufacturing. Custom tooling and design may also be necessary. We offer both standard and custom preforms tailored to specific requirements. Our patented InFORMS® technology, which is known for enhancing bondline control and reliability, is preferred for applications that demand precision.
Related Products
Indium Corporation offers a full line of wave fluxes that can meet the needs of numerous selective soldering applications. For example, the WF-9948 flux is excellent for those applications where reliability and minimal post-soldering residues are required.
High-Temperature Solder Pastes
Pb or Pb-free high-temperature solder
Durafuse® Technology
A patented solder alloy technology to enable complex
Gold Alloy Solder Pastes
No-clean and water soluble gold-tin solder pastes available in type 3-7 powder
Preform Alloys
SOLDER PREFORMS Preform Alloys Solder preforms come in standard shapes such as squares, rectangles, washers, and discs. Typical sizes range from 0.010″(0.254mm) up to 2″(50.8mm), though
Related Applications
Semiconductor Packaging & Assembly
Critical semiconductor packaging ensures functionality and
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
Related Markets
The Surge of Cu Sinter Paste
A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has has surged, highlighting Cu sintering's suitability for various
Ramp-to-Peak: The First Thought in a Reflow Profile
Folks, I am working on a book with my Indium Corporation colleagues on tackling soldering defects in electronics.It is a follow up to our The Printed Circuits Assembler's Guide to Solder Defects.
SPIE Photonics West 2024
Indium Corporation® had the privilege of exhibiting at the world’s premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics, SPIE Photonics
Development of Innovative Advanced Packaging Materials for System in Package
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous
Interconnect Reliability: From the Chip to the System
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,
Sinter material for power electronics – copper’s time to shine?
In recent years, silver sinter materials have grown in popularity in power module assembly, especially for die attach. When compared to traditional solders, silver sinter offers numerous benefits
Which Off-Eutectic AuSn Alloy Do I Use?
When working with dies and/or substrates that are thickly plated with pure gold, the best way to prevent gold-rich solder jointsis to use an off-eutectic AuSn alloy in the solder
So You Want to be in Manufacturing?
As a Manufacturing Process and Quality Engineer for over thirty years, I have seen a great deal of change with fantastic leaps in raw component, assembly, and metrology
Back to Basics: Au-Based Alloys
In history, “The Gold Standard” was a monetary system in which countries fixed their currencies to a specified amount of gold. Here at Indium, we also use the phrase, however, to
Your Success
is Our Goal
Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.