Die-Attach Solder Wire

Indium Corporation manufactures a soft solder (Fluxless) wire for die-attach applications. This high-quality, soft solder wire results in higher yields with fewer interruptions in production. It features:

• High purity raw materials
• Precise and consistent diameters
• Tightly controlled alloy chemistry
• Ultra-low oxide levels are controlled for enhanced wetting performance
• Manufactured to a specific process or piece of equipment

Die-Attach Paste

Although there are four major processes for die-attach, solder-based processes are still the most popular, as they provide high reliability with ease of processing. Indium Corporation’s die-attach solder paste is typically a dispensable, high melting-point solder paste, which is reflowed in forming gas (H2N2 mix).

• Key Performance Needs
• Low voiding in reflow
• Long dispense life
• No tailing
• No separation
• Bubble-free packaging
• Residue-free cleaning or residue compatible with overmolding process

"Power-Safe" NC-SMQ^®75 Die-Attach Solder Paste

NC-SMQ^®75 is the only solder paste suitable for use in non-cleaned clip-bonded applications in power semiconductor die-attach assemblies. It has:

• Superior wetting capabilities compared to most low residue formulations
• Trouble-free probe testing
• No-residue appearance

BiAgX^®75

BiAgX^®75 is a high-melting, lead-free solder paste technology that serves as a drop-in replacement for the high-Pb solder pastes used in many high-reliability, die-attach, and electronics assembly applications.