Indium Corporation provides high-performance precision gold preforms. Our manufacturing engineers have developed advanced gold and braze preform manufacturing technology to produce “best in class” precision preforms. These high-quality preforms redefine the boundaries of what’s capable in regard to complex designs and aggressive aspect ratios. Eutectic and off-eutectic options are available in preforms and ribbon.

For Die-Attach Applications

Indium Corporation’s AuLTRA^® ThInFORMS^™ are an excellent choice for die-attach applications. By using a preform with a thickness of 0.00035", the BLT is reduced and thermal transfer from the die to the substrate is improved, increasing the operational performance and efficiency of high-output lasers. Packaging designed for automated assembly of these preforms ensures repeatable success in a production process.

For Die-Attach Applications

Indium Corporation developed our AuLTRA^®-Fine Ribbon, Indalloy^®182 fine-grade precision ribbon, for high-volume, fully automated laser diode assembly processes. For these auto-feed systems, the precision and quality of the ribbon and spooling is of the utmost importance along with long, continuous lengths. These features help minimize production downtime and facilitate an efficient, high-throughput process resulting in a high-quality end product and low cost of ownership.

For Die-Attach Applications

Indium Corporation’s Off-Eutectic AuSn Alloys are an excellent choice for die-attach applications. Using an AuSn preform with a lower gold content allows for absorption of some of a die’s thick gold plating, finalizing the solder joint at a composition of 80Au/20Sn, which has high tensile (joint) strength properties. Packaging designed for automated assembly of these preforms ensures repeatable success in a production process.

Indium Corporation’s “Power-Safe” NC-SMQ75 is the only solder paste suitable for use in non-cleaned clip-bonded applications in power semiconductor die-attach assemblies. NC-SMQ75 is an ultra-low residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable residue of approximately 0.4 weight percent of paste.

Features:

• Superior wetting capabilities compared to most low-residue formulations
• Trouble-free probe testing
• No-residue appearance
• Works with common high-Pb alloys, SnSb, and SAC

BiAgX^® is a high-melting, lead-free (Pb-free) solder paste technology that serves as a DROP-IN replacement for the high-Pb solder pastes used in many high-reliability, die-attach, and electronics assembly applications.

BiAgX^® is the ONLY low-cost, lead-free replacement solder paste that is customer-proven to survive JEDEC/IPC J-STD-020 MSL1 pre-conditioning in specific devices without delamination.

Alpha emission can disrupt sensitive electronic components, causing concern in high-reliability devices. One source of alpha emission is the solder that is used to form interconnections between the substrate and chip.

Indium Corporation’s low-alpha range of high-Pb solder pastes, with alpha emission less than 0.01cph/cm², is proven to reduce gate oxide damage and enhance long-term reliability, especially for high-power devices. It is available with common high-Pb alloys with existing chemistries.