The term die-attach is reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
Come see Indium Corporation's new AuLTRA™ ThInFORMS™ at SPIE West in San Francisco, CA Feb. 4-6, 2020. AuLTRA™ ThInFORMS™ improve thermal transfer and the overall operational efficiency of die-attach applications.
Indium Corporation’s gold/tin solder paste gives manufacturers the versatility to produce high volumes of scaled-up product on demand without committing to component designs that would limit further research and development.
Indium Corporation manufactures die-attach wire, and die-attach paste. We also offer a product called BiAgX®, which is a drop-in replacement for high lead-containing solders.
Die-Attach Solder Wire
Indium Corporation manufactures a soft solder (Fluxless) wire for die-attach applications. This high-quality, soft solder wire results in higher yields with fewer interruptions in production. It features:
High purity raw materials
Precise and consistent diameters
Tightly controlled alloy chemistry
Ultra-low oxide levels are controlled for enhanced wetting performance
Manufactured to a specific process or piece of equipment
Although there are four major processes for die-attach, solder-based processes are still the most popular, as they provide high reliability with ease of processing. Indium Corporation’s die-attach solder paste is typically a dispensable, high melting-point solder paste, which is reflowed in forming gas (H2N2 mix).
Key Performance Needs
Low voiding in reflow
Long dispense life
Residue-free cleaning or residue compatible with overmolding process
BiAgX®75 is a high-melting, lead-free solder paste technology that serves as a drop-in replacement for the high-Pb solder pastes used in many high-reliability, die-attach, and electronics assembly applications.