Dean Payne is a Senior Technical Support Engineer responsible for coordinating and managing technical service and resources to multinational accounts in Asia. He also assists with new business development, new product development, and problem resolution. Dean is based at Indium Corporation’s Asia-Pacific Operations in Singapore.
Dean has more than 13 years of experience in the semiconductor/wafer fabrication. Prior to that, he worked as a Photolithography Process Engineer for an international semiconductor assembly and test facility, where he analyzed data, updated process specifications, and supervised process engineers.
Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.