07 May 2022 by Dr. Ron Lasky | View Bio
Folks, some years ago I created a software tool, StencilCoach™, to calculate the stencil parameters to provide for an adequate amount of solder paste for the p...
Read More06 May 2022 by Claire Hotvedt | View Bio
SIR testing has been around for a while. Why? And why might we want to use tests that are even more challenging than the current J-STD-004B?
Read More03 May 2022 by Jenny Gallery | View Bio
AuLTRA™ 3.2 and AuLTRA™ 5.1 are air or nitrogen reflow AuSn solder pastes specially formulated for higher processing temperatures and assembly needs required in high-power LED module array applications. These AuSn solder pastes offer consistent printing and reflow, in addition to exceptional wetting and low-voiding. AuLTRA™ 3.2 and AuLTRA™ 5.1 solder pastes are available in these alloy compositions: 80Au/20Sn, 79Au/21Sn, 78Au/22Sn, and 77Au/23Sn, and powder sizes 2 to 7SGS.
Read More15 Feb 2022 by Dr. Ron Lasky | View Bio
Folks, When comparing the volume of solder paste provided by a circular versus square aperture, consider that if the side of the square is D and the diameter o...
Read More16 Jan 2022 by Dr. Ron Lasky | View Bio
Folks, I will be presenting three papers at PanPac 2022. They are: 1. Low Melt High Remelt Solder Paste, co-authored with Claire Hotvedt of Indium Corporatio...
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