The Pin-in-Paste Process with Donut-Shaped Preforms
Folks, some years ago I created a software tool, StencilCoach™, to calculate the stencil parameters to provide for an adequate amount of so...
Folks, some years ago I created a software tool, StencilCoach™, to calculate the stencil parameters to provide for an adequate amount of so...
SIR testing has been around for a while. Why? And why might we want to use tests that are even more challenging than the current J-STD-004B?...
AuLTRA™ 3.2 and AuLTRA™ 5.1 are air or nitrogen reflow AuSn solder pastes specially formulated for higher processing temperatures and asse...
Folks, When comparing the volume of solder paste provided by a circular versus square aperture, consider that if the side of the square is D and the d...
Folks, I will be presenting three papers at PanPac 2022. They are: 1. Low Melt High Remelt Solder Paste, co-authored with Claire Hotvedt of Indium Cor...
Recently, I hosted a webinar for Stencil Printing for System in Package Applications. I wanted to take some time to offer a better explanation on impo...
Stencil technology has evolved throughout the years, and System-in-Package solder pastes require specific stencil manufacturing processes and novel te...
Just as important in the solder paste printing process is solder paste inspection; how do you know if your printer is operating optimally if your SPI ...
Choosing the correct solder paste formulation is critical for System-in-Package assembly. Indium Corporation's SiPaste® solder pastes offer a ...
Shielding the RF waves generated by an MRI machine is mandatory. Soldered copper is one the metals used for RF shielding because it absorbs radio and ...
Folks, I am re-posting an updated blog post on Cp and Cpk calculations with Excel®, as I have improved the Excel® spreadsheet. If you wou...
Recently, I hosted a webinar for Stencil Printing 101. The InSIDER Series contained two parts. The first is on the basics: Solder paste 101 – th...