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A Composite Solder Alloy Preform for High Temperature Pb-Free Soldering Applications
Authors: Dr. Ning-Cheng Lee, Paul Bachorik
A Comprehensive Guide to X-ray Inspection
Authors: Adam Murling, Brittany Vanderhoof
A Drop-In Lead-Free Solder Replacement
Authors: Dr. Ning-Cheng Lee, James Slattery, John R. Sovinsky
A Model Study of Profiling for Voiding Control at Lead-free Reflow Soldering
Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu
A Novel Epoxy Flux On Solder Paste for Assembling Thermally Warped PoP
Authors: Dr. Ning-Cheng Lee, Lee Kresge
A Novel Epoxy Flux on Solder Paste for Assembling Thermally Warped PoP
Authors: Dr. Ning-Cheng Lee, Lee Kresge
A Novel Flexible Silver Paste Enables Thin Film Photovoltaic Flex Solar Cells
Authors: Dr. Ning-Cheng Lee, James Slattery, Lee Kresge
A Review of Test Methods and Classifications for Halogen-Free Soldering Materials
Authors: Timothy Jensen
A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly
Authors: Amanda Hartnett, Indium Corporation, Jacques Matteau, Omar Knio, Ronnie Spraker
A Unique Reflow Process for LEDs
Authors: Charlie Wilkinson, Derrick Herron, John Mathurin
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via MN or CE Doping (Chinese)
Authors: Dr. Ning-Cheng Lee
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via MN or CE Doping (English)
Authors: Dr. Ning-Cheng Lee
Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping
Authors: Dr. Ning-Cheng Lee, Dr. Ronald C. Lasky, Timothy Jensen
Achieving High-Rel for Die-Attach via Pressureless Sintering of Nano-Ag Paste
Authors: Christine LaBarbera, Dr. Ning-Cheng Lee, Guangyu Fan, Lee Kresge, Sihai Chen
Achieving Increased Solder Joint Reliability and Low-Voiding in High Power Applications
Authors: Adam Murling, Seth Homer, Sunny Neoh, Timothy Jensen
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly (Chinese)
Authors: Indium Corporation
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly (English)
Authors: Indium Corporation
Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework
Authors: Dr. Ronald C. Lasky, Ed Briggs
Aiming for High First-pass Yields in a Lead-free Environment
Authors: Indium Corporation
Availability of Indium and Gallium
Authors: Claire Mikolajczak, Indium Corporation, Shuyan Peng
Best Practices Reflow Profiling for Lead-Free SMT Assembly (Chinese)
Authors: Dr. Ronald C. Lasky, Ed Briggs
Best Practices Reflow Profiling for Lead-Free SMT Assembly (English)
Authors: Dr. Ronald C. Lasky, Ed Briggs
Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue
Authors: Eric Bastow
Challenges in Fine Feature Solder Paste Printing for SiP Applications
Authors: Andy C. Mackie PhD, Kenneth Thum, Sze Pei Lim
Challenges in Fine Feature Solder Paste Printing for SiP Applications - German
Authors: Andy C. Mackie PhD, Kenneth Thum, Sze Pei Lim
Challenges of Ball-Attach Process Using Flux for Fan-Out Wafer-Panel Level Packaging (FOWLP-PLP)
Authors: Dr. Yan Liu, Sze Pei Lim
Challenges of Implementing a Halogen-Free PCB Assembly Process (Chinese)
Authors: Dr. Ronald C. Lasky, Timothy Jensen
Challenges of Implementing a Halogen-Free PCB Assembly Process (English)
Authors: Dr. Ronald C. Lasky, Timothy Jensen
Comparison of Test Methods for High Performance Thermal Interface Materials
Authors: Bob Jarrett, C.K. Merritt, Jim Hisert, Jordan Ross
Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter
Authors: Andy C. Mackie PhD, Christopher Nash
Correlation of SIR
Authors: Dr. Ronald C. Lasky, Indium Corporation, Nicole Palma
Defect Elimination Through Process Refining and Proper Material Choice
Authors: Indium Corporation
Determination of Total Halogen Content in Halogen-Free Fluxes by Inductively Coupled Plasma
Authors: Christopher J. Pontius, Dr. Ronald C. Lasky, George Kraeger
Die-Attach Void Reduction by Using Gold Alloy Solder Preforms
Authors: Andy C. Mackie PhD, Bernard Leavitt
Does Solder Particle Size Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue?
Authors: Eric Bastow
Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue
Authors: Eric Bastow
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Authors: Indium Corporation
Effect of Nano-Coated Stencil on 01005 Printing
Authors: CEMA, Chris Anglin, Rita Mohanty Ph.D, S. Manian Ramkumar Ph.D, Toshitake Oda
Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
Authors: Eric Bastow
Eliminate Lead-free Wave Soldering (English)
Authors: Indium Corporation, Karl Pfluke, Rick Short
Engineering Solder Paste Performance Via Controlled Stress Rheology Analysis
Authors: Dr. Ning-Cheng Lee
Epoxy Flux - A Low Cost High Reliability Approach for PoP Assembly
Authors: Dr. Ning-Cheng Lee, Indium Corporation
Epoxy Flux: Exploring the Most Versatile, Low-Cost Approach for High Reliability in PoP Assembly
Authors: Dr. Ning-Cheng Lee
Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly
Authors: Indium Corporation
Evaluation of Test Protocol for Eutectic Die-Attach Using High Power LEDs
Authors: Indium Corporation
Fine Feature Stencil Printing 0.3MM Pitch Components (Chinese)
Authors: Dr. Ronald C. Lasky, Ed Briggs
Fine Feature Stencil Printing 0.3MM Pitch Components (English)
Authors: Dr. Ronald C. Lasky, Ed Briggs
Fine Powder Solder Pastes: Stencil Printing and Reflow in Lead-Free Assembly
Authors: Dr. Ronald C. Lasky, Ed Briggs, Timothy Jensen
Flux Challenges in Flip-Chip Die-Attach - Traditional Chinese
Authors: Andy C. Mackie PhD, Jason Chou, Sze Pei Lim
Future Lead-Free Solder Alloys and Fluxes-Meeting Challenges of Miniaturization
Authors: Dr. Ning-Cheng Lee
High Technology Challenge: Assembling Today's Miniaturized Electronics Products
Authors: Dr. Ronald C. Lasky
High Temperature Lead-Free Solder Joints Via Mixed Powder System
Authors: Dr. Ning-Cheng Lee, HongWen Zhang
High Temperature, Pb-Free, Metallic Sputtering Target Bonding Using Reactive Multilayer Foil
Authors: Jim Hisert, Ronnie Spraker
High-Density Assembly and Root Cause Analyses
Authors: Christopher Nash, David Sbiroli, Jonas Sjoberg, Wisdom Qu
High-Lead Solder Failure & Microstructure Analysis in Die-Attach Power Discrete Packages
Authors: HongWen Zhang, Sze Pei Lim
High-Reliability No-Clean Solder Paste for Designs Where Flux Cannot be Dried
Authors: Dr. Ning-Cheng Lee
High-Reliability, High-Melting, Mixed Lead-Free BiAgX® Solder Paste System
Authors: Dr. Ning-Cheng Lee, HongWen Zhang
High-Temperature Lead-Free Solder Joints Via Mixed Powder System
Authors: Dr. Ning-Cheng Lee, HongWen Zhang, Indium Corporation
How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding
Authors: Indium Corporation
Impact of Stencil Quality on Solder Paste Printing Performance
Authors: Evan Yin, Jeffrey Len, Leon Rao, Wisdom Qu
Indium-Lead (InPb) Solder Alloys for Reliable Gold Interconnects in Assembly Processes
Authors: Indium Corporation
Influence of Reflow Profile and Pb-Free Solder Paste in Minimizing Voids for Quad Flat Pack No-Lead (QFN) Assembly
Authors: Ed Briggs, Indium Corporation, Timothy Jensen
Ionic Cleanliness Testing Research of Printed Wiring Boards for Purposes of Process Control
Authors: Dr. Ning-Cheng Lee
Low-Porosity Pressureless Sintering of Nano-Ag Paste for Die-Attach
Authors: Christine LaBarbera, Dr. Ning-Cheng Lee, Guangyu Fan, Indium Corporation, Lee Kresge, Sihai Chen, Xue Yan
Material and Process Optimization for HIP Defect Elimination
Authors: Dr. Ronald C. Lasky, Sehar Samiappan, Timothy Jensen
Material and Process Optimization for Head-in-Pillow Minimization
Authors: Dr. Ronald C. Lasky, Sehar Samiappan, Timothy Jensen
Meeting Solder Paste Printing Challenges for SiP in “Smart” IoT Devices
Authors: Andy C. Mackie PhD, Kenneth Thum, Sze Pei Lim
Nano-Cu Sintering Paste for High-Power Devices Die-Attach Applications
Authors: Dr. Ning-Cheng Lee, Min Yao
NanoBond® Assembly - A Rapid, Room Temperature Soldering Process
Authors: Indium Corporation
New Developments in High Performance Solder Products for Power Die Assemblies
Authors: Andy C. Mackie PhD, Graham Wilson, Indium Corporation, Mike Fenner
Next Generation PoP Pastes for Electronics Assembly
Authors: Brandon Judd, Jim Hisert
Next Level Requirements for Ultra Fine Pitch Printing
Authors: Indium Corporation
No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
Authors: Eric Bastow
Novel Approaches to Benchmarking Solar Cell Tabbing Solder
Authors: Karl Pfluke, Rick Lathrop
Novel Technique to Reduce Substrate Tilt and Improve Bondline Control Between AlN Substrate and AlSiC Baseplate in IGBT Module
Authors: Andy Dai, James Booth, Karthik Vijay, Kim Evans, Matthew Packwood, Paul Mumby-Croft
Photovoltaic Module Assembly Using SMT Assembly Materials and Processes
Authors: Indium Corporation
Porosity Evolution of Ag-Sintering at Die-Attach
Authors: Christine LaBarbera, Dr. Ning-Cheng Lee, Guangyu Fan, Lee Kresge
Pressure-less Silver Sintering Paste for Low Porosity Joints and Large Area Die
Authors: Christine LaBarbera, Dr. Ning-Cheng Lee
Printing Capability Study of 008004 (0201 m) Components for SiP Applications - Part I
Authors: Jonas Sjoberg, Kenneth Thum, Sze Pei Lim
Printing Capability Study of 008004 (0201 m) Components for SiP Applications - Part II
Authors: Fiona Chen, Indium Corporation, Jonas Sjoberg, Kenneth Thum, Sze Pei Lim, Wisdom Qu
Process Guidelines to Ensure Optimal SMT Electronics Assembly
Authors: Dr. Ronald C. Lasky, Ed Briggs
Process Optimization for Fine Feature Solder Paste Dispensing
Authors: Brandon Judd
Process and Reliability Advantages of AuSn Eutectic Die-Attach
Authors: Indium Corporation
Process and Solder Paste Considerations for BGA and QFN Voiding in a Tin-Lead Mixed System
Authors: ICA
QFN Voiding Control Via Solder Mask Patterning on Thermal Pads
Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu
Reflow Profiling for Next-Generation Solder Alloys
Authors: Indium Corporation, Kim Flanagan, MaryBeth Allen, Meagan Sloan
Reinforced Solder Preforms for High-Reliability and Low-Voiding
Authors: Adam Murling, Sunny Neoh, Timothy Jensen
Reliability of BiAgX® Solder as a Drop-In Solution
Authors: Dr. Ning-Cheng Lee, HongWen Zhang, Indium Corporation
Reliability of PCB Solder Joints Assembled with SACm® Solder Paste
Authors: Christine LaBarbera, Dr. Arnab Dasgupta, Dr. Ning-Cheng Lee, Fengying Zhou, Indium Corporation, Paul Bachorik, Weiping Liu
Room Temperature LED and D-Pak Type Component-Attach and Reliability Testing
Authors: Indium Corporation
Rosin vs. Non-Rosin Wave Flux: Which Creates More Reliable Electronic Assemblies?
Authors: Adam Murling, Dr. Ronald C. Lasky
SAC105 Stencil Printing Process using Cross Viscosity Model
Authors: Damian G. Santhanasamy
SMQ®75 - A No-Clean Die-Attach Solder Paste for Clip-Bonding
Authors: Andy C. Mackie PhD, Sehar Samiappan
Sealing the Gap of Solder Paste Technology in Lead-Free Halogen-Free Era
Authors: Dr. Arnab Dasgupta, Dr. Ning-Cheng Lee, Dr. Yan Liu
Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly
Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu, Pamela Fiacco
Silver Sintering Pastes Rendering Low-Porosity Joints
Authors: Christine LaBarbera, Dr. Ning-Cheng Lee, Sihai Chen
Six Sigma® Techniques for Solder Paste Selection
Authors: Dr. Ronald C. Lasky, Wang Ming
Sn+ Heat- Spring® Solder TIMs for Superior Thermal Management in IGBT Power Modules
Authors: Bob Jarrett, Graham Wilson
Solder Paste Attributes for System-in-Package (SiP) Assembly
Authors: Andy C. Mackie PhD, Kenneth Thum, Sze Pei Lim
Solder Paste: Meeting The SMT Challenge
Authors: Dr. Ning-Cheng Lee, Gregory Evans
Soldering Challenges in a Halogen-Free PCB Assembly Process (Chinese)
Authors: Dr. Ronald C. Lasky, Timothy Jensen
Soldering Challenges in a Halogen-Free PCB Assembly Process (English)
Authors: Dr. Ronald C. Lasky, Timothy Jensen
Soldering: Is the automotive assembler really different to anyone else?
Authors: Indium Corporation
Specification Limits Review for Solder Paste Stencil Print Inspection (SPI)
Authors: David Sbiroli, Ed Briggs
Spin-Coating Waferbumping Fluxes for SEMI Assembly
Authors: Andy C. Mackie PhD, Indium Corporation, Maria Durham, Sze Pei Lim
Stencil Printing Transfer Efficiency of Circular vs. Square Apertures with the Same Solder Paste Volume
Authors: Ed Briggs
The Benefits of Flux-Coated Solder Preforms in a QFN Assembly Process
Authors: Brandon Judd
The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of Hi Rel PB free Solder Alloys
Authors: HongWen Zhang, Indium Corporation, Jie Geng
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
Authors: Brandon Judd
The Effect of a Nitrogen Reflow Environment on the Electrical Reliability of Rosin-Based No-clean Solder Paste Flux Residues
Authors: Eric Bastow
The Effects of Partially Activated No-Clean Flux Residues Under Component Bodies
Authors: Eric Bastow
The Graping Phenomenon: Improving Pb-Free Solder Coalescence Through Process and Material Optimization
Authors: Indium Corporation, Timothy Jensen
The Question of Sample Size: Print Performance Trials for Solder Paste Evaluation
Authors: Indium Corporation
The Second Generation Shock Resistant and Thermally-Reliable Low Ag SAC Solder with Mn
Authors: Dr. Ning-Cheng Lee, Indium Corporation, Jeffrey ChangBing Lee, Matthew Brown, Valid Goudarzi, Weiping Liu
The Superior Drop Test Performance of SAC-Ti Solders and Its Mechanism
Authors: Dr. Ning-Cheng Lee, Paul Bachorik
Thermal Pad Design and Process for Voiding Control at QFN Assembly
Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu
Through-Hole Assembly Options for Mixed Technology Boards
Authors: Dr. Ronald C. Lasky, Ross B. Berntson
Types of Solder Preforms and Difficult Geometries
Authors: Adam Murling, Herbert Ludowieg, Indium Corporation
Ultra-Low Voiding, Halogen-Free, No-Clean, Lead-Free Solder Paste for Large Pads
Authors: Dr. Ning-Cheng Lee, Li Ma
Update on Electrically Conductive Ink: Capabilities and Limitations
Authors: Dr. Ning-Cheng Lee, Indium Corporation
Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing
Authors: Dr. Ronald C. Lasky, Indium Corporation
Voiding Control Beneath BTCs Using Solder Fortification® Preforms SC
Authors: Christopher Nash, Raymond Luo
Voiding Control Beneath Bottom Terminated Components Using Solder Fortification® Preforms
Authors: Christopher Nash, Raymond Luo
Voiding Control at High-Power Die-Attach Preform Soldering
Authors: Dr. Ning-Cheng Lee, Elaina Zito
Voiding Reduction in Bottom Terminated Components (BTC) with Improved Flux Coating
Authors: Dr. Ronald C. Lasky
Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys
Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu, Erin Page, Indium Corporation, Joanna Keck
Voiding of Lead-Free Soldering at Microvia
Authors: Dr. Hyoryoon Jo, Dr. Ning-Cheng Lee
Volumetric Characterization of Reservoir Printing in Deep Cavities
Authors: Mark Reese, Phani Vallabhajosyula, William Coleman
Most Popular Whitepapers
A Composite Solder Alloy Preform for High Temperature Pb-Free Soldering Applications
Authors: Dr. Ning-Cheng Lee, Paul Bachorik
A Comprehensive Guide to X-ray Inspection
Authors: Adam Murling, Brittany Vanderhoof
A Drop-In Lead-Free Solder Replacement
Authors: Dr. Ning-Cheng Lee, James Slattery, John R. Sovinsky
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awojcik@indium.com
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