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Ronald C. Lasky, PhD, PE

Ronald C. Lasky, PhD, PE

Senior Technologist

Indium Corporation
Phone: +1 (508) 930-2242
E-mail: rlasky@indium.com
Address: 34 Robinson Rd, Clinton, NY USA 13323

  • Certifications:
  • SMTA
  • 6 Sigma Black Belt

Blog

Ronald C. Lasky, PhD, PE's Blog

Biography

Ronald C. Lasky, PhD, PE DistinctionDr. Lasky is a Senior Technologist at Indium Corporation, as well as a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than thirty years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics.

Dr. Lasky has authored six books, and contributed to nine more, on science, electronics, and optoelectronics. He has also authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion.

Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Association’s Founder’s Award in 2003.

Dr. Lasky holds four degrees, including a Ph.D. from Cornell University in materials science, and is a licensed professional engineer. He lives with his wife in Massachusetts.

Awards

  • IBM Outstanding Technical Contribution Award 1981
  • IBM Outstanding Technical Achievement Award 1991
  • IBM 1st Level Patent Award
  • IBM Publications Award Levels I-IV
  • SMTA Founders Award 2003

Technical Papers Published

(Those Published and Presented are in Bold)

  • R. C. Lasky, et al, Moisture Solubility and Diffusion in Epoxy and Epoxy Glass Composites, The IBM Journal of Research and Development, Vol 28, No. 6, November 1984.
  • R. C. Lasky, Ph.D., Thesis, Cornell University, 1986.
  • C.-Y. Hui, K.-C. Wu, R.C. Lasky and E.J. Kramer, "Case II Diffusion in Polymers I: Transient Swelling", (MSC Report # 5826) J. Appl. Phys., 61 5129-5136 (1987).
  • C.-Y. Hui, K.-C. Wu, R.C. Lasky and E.J. Kramer, "Case II Diffusion in Polymers II: Steady State Front Motion", (MSC Report #5844) J. Appl. Phys., 61 5137-5149 (1987).
  • C.-Y. Hui, K.-C. Wu, R.C. Lasky and E.J. Kramer, "Chemically-Driven Deformation of Polymers", (MSC Report #5851) Trans ASME , J. of Electronic Packaging, 111 68-73 (1989).
  • R.C. Lasky, E.J. Kramer and C.-Y. Hui, "The Initial Stages of Case II Diffusion at Low Penetrant Activities", (MSC Report #6148), Polymer, 29 673 (1988).
  • R.C. Lasky, E.J. Kramer and C.-Y. Hui, "The Temperature Dependence of Case II Diffusion", (MSC Report #6184), Polymer, 29 1131 (1988).
  • T. P. Gall, R. C. Lasky and E. J. Kramer, "Case II Diffusion: Effect of Solvent Molecule Size", MSC Report #6706, Polymer, 31, 1491-1499 (1990).
  • R. G. Bayer, R. Ginsburg, R. C. Lasky, Settleable and Airborne Particles in Industrial Environments, pp 155-166, Proceedings of the 35th IEEE Holm Conference, September 1989, Chicago.
  • R. C. Lasky, et al., Use of Surface Analysis Techniques in Electronic Packaging, pp 323-329, ASM Conference Proceedings 3rd Electronic Materials & Processing Congress, San Francisco, August 1990.
  • V. Lundell, T. Kellerman, R.C. Lasky, Reliability Criteria for Data Communication Fiber Optic Cables/Connectors, pp 209-214, ASM Conference Proceedings in Materials Developments in Microelectronic Packaging: Performance and Reliability, 1991.
  • D. P. Clement, U. Osterberg, R. C. Lasky, Analytical Coupling Model for Obliquely polished single-mode cables, IEEE Photon. Techno. Lett. 5, 1422-1444.
  • M. D. Snyder, R. C. Lasky, Overview of Solder Jetting, Proceedings of the Materials Research Society, Spring 1995, San Francisco, CA.
  • R. C. Lasky, Critical Issues in Electronics Assembly, Circuits Assembly Magazine, Fall 1995- Winter 1996.
  • R. C. Lasky, Critical Issues in Electronics Assembly, Electronic Packaging and Assembly Magazine, Fall 1997-Winter 1998.
  • R. C. Lasky. D. Baldwin, B. Lewis, Metrics: The Key to Productivity, Proceedings of the IPC/SMTA Electronics Assembly Expo 1998, Providence, RI.
  • R. C. Lasky, D. Baldwin, Cost Estimating To Maximize Profit by Monitoring and Improving Cost Metrics, Proceedings of NEPCON 1999, Anaheim, CA.
  • R. C. Lasky, Y. Y. Morvan, What is Needed to Establish Flip Chip as a Standard SMT Process, Proceedings of NEPCON 1999, Anaheim, CA.
  • D. Baldwin, R. C. Lasky, J. Belmonte, K. Murray, Real Time Cost Estimates Measure ROI, pp 46-52, SMT Magazine, Sept 1999.
  • R. C. Lasky, A. Rae, Y. Morvan, Critical Issues in Electronics, 2nd Singapore SMTA Seminar "SMT in the New Millennium", 15 October 1999, Royal Crowne Plaza Singapore.
  • R. C. Lasky, A. Rae, Economic Considerations of Lead Free Assembly, 2nd Singapore SMTA Seminar "SMT in the New Millennium", 15 October 1999, Royal Crowne Plaza Singapore.
  • R. C. Lasky, Real Time Costing as a Tool to Improve Profitability, Proceedings of APEX 2000, Los Angeles, CA.
  • R. C. Lasky, Small Process Improvements Equal Large Profits, Proceedings of the SMTA International Conference, September 24-28, 2000, Chicago.
  • M. Mukadam, D. Santos, S. Dalton, R. C. Lasky, Process Modeling to Maximize Productivity and Profit in BGA Assembly, Proceedings of APEX 2001, San Diego, CA.
  • J. Belmonte, R. C. Lasky, D. Santos, A Production and Profit Simulation of a Superfactory, Proceedings of APEX 2001, San Diego, CA.
  • G. Jones, R. C. Lasky, Electronic Packaging and Production Magazine, June 2001
  • R. C. Lasky, Prashant Chouta, Critical Issues in Optoelectronic Assembly, pp 1-5, Proceedings of the Technical Program: Optoelectronics and the Telecom Revolution, SMTA, Dallas, November 14-15, 2001.
  • R. C. Lasky, J. L. Morvan, Fundamentals and Challenges in Optoelectronic Assembly, Proceedings of the Technical Conference, APEX, San Diego, January 22-24, 2002.
  • R. C. Lasky, K. A. Lasky, J. A. Su, Throughput Estimator for SMT Productivity a Low Cost Tool , Proceedings of the Technical Conference, APEX, San Diego, January 22-24, 2002.
  • J. Belmonte, R. C. Lasky, A Guide to Assessing the Performance of Your Manufacturing Operation, Proceedings of the Technical Conference, APEX, San Diego, January 22-24, 2002.
  • R. K. Warren (R. C. Lasky et al “ghost writers”), Proceedings of the 41st Electronic Components Technology Conference, Atlanta, GA, May 11-16, 1991, pp161-168, IEEE Pubs.
  • R. C. Lasky, The Greatest Challenge for Electronic AssemblyEPP Magazine, 2002
  • R. C. Lasky, The Importance of Incremental Uptime in the Assembly of High Value PCBsSMT Magazine, April 2003.
  • R. C. Lasky, T. Jensen, Assembling Chip Scale Packages with High YieldsChip Scale Review, Nov-Dec 2002.
  • R. C. Lasky, Daryl Santos, Pohly Doug, Establishing a Continuous Improvement Plan to Dramatically Increase Profit, at SMTAI, Chicago, IL, Sept 2002.
  • R. C. Lasky, Jensen, T., Practical Tips in Implementing the “Pin in Paste” Process, at SMTAI, Chicago, IL, Sept 2002.
  • R. C. Lasky, Materials and Process Challenges In RF And Optoelectronics Assembly, at SMTAI, Chicago, IL, Sept 2002
  • R.C. Lasky, R. H. Short, A Self Assessment Software Tool for SMT Processes and Productivity Optimization, APEX, Anaheim, April 2003.
  • R.C. Lasky, Daryl. Santos, J. R. Cloyd, An Effective Design of Experiment Strategy to Optimize SMT Processes APEX, Anaheim, April 2003.
  • R. C. Lasky, Amey Teredesai, Daryl L. Santos, Questioning the Need for Automation in Optoelectronic Assembly, OMI, Ottawa, April 2003.
  • R. C. Lasky, D. Santos, A. A. Bhave, Leaded and Lead-free Solder Paste Evaluation Screening Procedure,  at SMTAI, Chicago, IL, Sept 2003.
  • R. C. Lasky, Tin Pest: A Forgotten Issue in Lead-free Soldering?, at SMTAI, Chicago, IL, Sept 2004.
  • R. C. Lasky, Time and the Twin Paradox, Scientific American Special, ppf 20, Volume 16, Number 1, 2006.
  • R.C. Lasky, The Procrastinator’s Guide to WEEE and RoHS Compliance, IPC/Soldertec RoHS Conference, Malmo, Sweden 25-27 April 2006.
  • Belmonte, Joseph, R. C. Lasky, etal, Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing, IPC Lead-Free, Boston, December 2006.
  • Belmonte, Joseph, R. C. Lasky, etal, Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing, APEX, Los Angeles, February 2007.
  • Lasky, Ronald, Perry, Phillip, Counterfeit Electronic Component Thereat Looms Large, Circuitree, June 1, 2007.
  • Bixeman, Michael, Gervascio, Thomas, R. C. Lasky, Using Six Sigma Techniques to Optimize Cleaning in Class III Electronics, SMTAI, Orlando, FL, October 2007.
  •  Bratnikov, Alexander, R. C. Lasky, Assembly of Large PWBs in a RoHS Environment, APEX, Las Vegas, NV, April 2008.
  • Mohanty, Rita, R. C. Lasky, etal, Investigating the 01005-Component Assembly Process Requirements,  APEX, Las Vegas, NV, April 2008.
  • Jensen, T., R. C. Lasky, Implementing a Halogen Free Assembly Process, SMTAI, Orlando, FL, Aug 2008.
  • Jensen, T., Harnett A., R. C. Lasky, Halogen-Free Solder Pastes And Fluxes: Implementation Challenges, SMTAI, San Diego, October 2009.
  • Anglin, C., Briggs, E., R. C. Lasky, Fine Feature Stencil Printing 0.3mm Pitch Components, SMTAI, San Diego, October 2009.
  • E. Briggs, R. C. Lasky, Best Practices Reflow Profiling For Lead-Free SMT Assembly, SMTAI, San Diego, October 2009.
  • R. C. Lasky, Mathematics Learning Outcomes for Engineers in an Age of Excel®, MATLAB®, etc: Some Observations and Thoughts, 2010 American Society for Engineering Education Northeast Section Conference, May 7 and 8, 2010, Boston, MA.
  • Briggs, E., R. C. Lasky, Process Optimization to Prevent the Graping Effect, SMTA Toronto Expo and Tech Forum, May 19, 2010.
  • Gowans, Carol and R. C. Lasky, Applications of Solder Fortification With Preforms, October 25, 2010, SMTAI 2011, Orlando, FL.
  • Gowans, Carol and R. C. Lasky, Applications of Solder Fortification With Preforms, April 12, 2011, APEX 2011, Las Vegas, NV.
  • R. C. Lasky, Tin Pest: Elusive Threat in Lead-Free Soldering, Journal of Failure Analysis & Prevention, Volume 10, Number 6, December 2010 , pp. 437-443(7).
  • Briggs, Edward, Sandy, Brook, and R. C. Lasky, Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework, SMTA, Toronto, May 2011.
  • R. C. Lasky, Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability, September 22, 2011, IPC Mid-West, Chicago, IL.
  • Homer, Seth, and R. C. Lasky, Minimizing Voiding In QFN Packages Using Solder Preforms, October 12, 2011, IMAPS, Long Beach, CA.
  • Sandy, Brook, and R. C. Lasky, Choosing A Low-Cost Alternative To SAC Alloys For PCB Assembly: Preliminary Work, SMTAI, October 16-20, 2011, Fort Worth, TX.
  • Palma, Nicole and R. C. Lasky, Correlation of SIR, Halide/Halogen, and Copper Mirror Tests, SMTAI, October 16-20, 2011, Fort Worth, TX.
  • Homer, Seth, and R. C. Lasky, Minimizing Voiding In QFN Packages Using Solder Preforms, SMTAI, October 16-20, 2011, Fort Worth, TX.
  • Sandy, Brook, R. C. Lasky, Choosing a Low-Cost Alternative to SAC Alloys for PCB Assembly, APEX, February 28-March 1, 2012, San Diego, CA.
  • R. C. Lasky, Time and the Twin Paradox, Scientific American Special, ppf 30, Volume 21, Number 1, Spring, 2012.
  • R. C. Lasky, Palma, Nicole, Correlation of SIR, Halide/Halogen, and Copper Mirror Tests, APEX, February 28-March 1, 2012, San Diego, CA.
  • Homer, Seth, and R. C. Lasky, Minimizing Voiding In QFN Packages Using Solder Preforms (Updated), APEX, February 28-March 1, 2012, San Diego, CA.
  • Jensen, Timothy, R. C. Lasky, Samiappan, Sehar, Material and Process Optimization For HIP Defect Elimination, SMTA SE Asia, April 2012, Penang.
  • R. C. Lasky, A Focus on Productivity and Profitability: Several Case Studies, SMTAI, October 16-18, 2012, Orlando, FL.
  •  Jensen, Timothy, R. C. Lasky, Material and Process Optimization for HIP Defect Elimination, APEX 2013, February 19-21, 2013, San Diego, CA.
  • R. C. Lasky, Gowans, Carol, A New Alloy for Medical Electronics Applications, Medical Design Briefs, ppf 28, September 2013.
  • R. C. Lasky, Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing, SMTAI, October, 2013, Fort Worth, TX.

Presentations/Workshops

  • Scanning Electronic Microscopy as a Failure Analysis Tool, Binghamton University, Spring 1978.
  • The Challenges of Implementing a New Resin in PWB Manufacturing, Cornell University, 1983, 86, 87, 93, 95, 96
  • Technical Estimating: The Second Most Important Skill, Cornell University 1988, 89, 96, 97, 98, 99, 2000, Dartmouth 1997.
  • Job Interviewing: A View from the Other Side: Binghamton University 1991, Dartmouth 1996, 1997.
  • Tips for Success: Dartmouth 1997
  • Electronic Assembly: USMA at West Point, 1996.
  • Economic Considerations of Lead Free Processing, Lead Free Soldering and Interconnection Symposium, Binghamton University, December 6-8, 1999.
  • Critical Issues in Optoelectronic Assembly, International Electronics Packaging Symposium, Binghamton University, June 25-27, 2001.
  • Beyond a Reasonable Doubt: Evidence for a Designed Universe, Cornell 1999, Purdue 1999, MIT 2000, Wheaton College 2000, Boston University 2001, University of Connecticut, Harvard 2001, Bowdoin College 2001, Bates College 2001, Colby College 2001, Bates College 2002.
  • Fundamentals of Optoelectronics, Cal Tech 1992, Dartmouth 1992, Cornell 1992, Yale, 1992, Princeton 1992.
  • Fundamentals of Optoelectronic Assembly, SMTA Dallas 2001, APEX, SMTA Toronto, SMTA NEPCON East 2002
  • Critical Issues in Electronic Assembly: 1997-2002 more than 20 times
  • Design for Manufacturability in SMT Assembly, SMTA Toronto, RIM 2002
  • Stencil Printing Using Software Tools, SMTA NEPCON East
  • Challenges in Optoelectronic Assembly, 2001-2002 more than 10 times
  • Auditing Your SMT Facility for Maximum Profitability: Libra 2002, Leitch
  • Trends in Electronics¸ IEEE Boston, Fall 2006.
  • Trends in Electronics, Counterfeit Components, WEEE/RoHS Overview, Applying SPC to SMT, CONCIBE 2007, Guadalajara, MX.
  • Alloy Convergence in Lead-Free Assembly, Philips Corp, February, 2008.
  • Lead-Free Assembly of Large PWBs, APEX, Las Vegas, March 2008.
  • Beyond RoHS: Sustainable Design, How to Interview for a Job, CONCIBE June 2008, Guadalajara, MX.
  • Halogen Free Electronic Assembly, SMTAI, Orlando, August 2008.
  • Trends in Electronics 2008, SMTAI, August 2008, Orlando Florida.
  • The Threat of Counterfeit Components, SMTAI, August 2008, Orlando Florida.
  • DOE and Statistics for Cellulosic Ethanol Research, Mascoma Corp, Lebanon, NH, 2008.
  • Minimizing Defects in Lead-Free Assembly, JEDEC/IPC, Dallas, December 2008.
  • SMT/Electronics: The Next 25 Years, Keynote speaker, SMTAI, San Diego, October, 2009.
  • Lead-Free Assembly for High Yields and Reliability, APEX, Las Vegas, April 2010.
  • Lead-Free Alloy Proliferation, SMTA Boise, Idaho, April 9, 2010.
  • The Impact of RoHS, Jones Seminar, Thayer School, Dartmouth, April 29, 2010.
  • Solder Sphere Head-in-Pillow: Causes and Solutions, IMAPS, Marlboro, MA, May 4, 2010.
  • Mitigating Graping and the Head-in-Pillow Defects, June 9, 2010, SMTA Mn-StP, MN.
  • 01005 Passive and 0.3 mm CSP Stencil Printing, September 21, 2010, SMTA Capital Expo, John Hopkins University, Laurel , MD.
  • Mitigating Graping and the Head-in-Pillow Defects, September 21, 2010, SMTA Capital Expo, John Hopkins University, Laurel , MD.
  • Establishing a High-Yield, Pb-free Process, including Ultra Fine Pitch Printing for Passives and CSPs, October 7, 2010, SMTA Austin, TX.
  • Mitigating Graping and the Head-in-Pillow Defects, November 17, 2010, SMTA Nutmeg Meeting, Hartford, CT.
  • The Proliferation of Lead-Free Alloys, May 3, 2011, IMAPS New England, Boxboro, MA.
  • Electronics: Evolution or Revolution, Cook Seminar, Dartmouth College, Hanover, NH.
  • Optimizing a Miniaturized PCB Assembly Process in a Lead-Free, Halogen-Free Era, April 10, 2011, APEX 2011, Las Vegas, NV.
  • Lead-Free Assembly for High Yields and Reliability, April 11, 2011, APEX 2011, Las Vegas, NV.
  • An Introduction to Sampling, June 10, 2011, SBE Electronics, Barre, VT.
  • Lead-free Assembly for High Yields and Reliability, September 22, 2011, IPC Mid-West, Chicago, IL.
  • A Status of Lead-Free Assembly: A Perspective, PERM meeting, September 27, 2011, Naval Surface Warfare Center, Crane, IN.
  • Lead-free Assembly for High Yields and Reliability, ACI, December 6 and 7, 2011, Philadelphia, PA.
  • Lead-free Assembly for High Yields and Reliability, APEX, February 26, 2012, San Diego, CA.
  • A Focus on Productivity, Graping and the Head in Pillow Defect, Solder Preforms for PIP, given to valor Electronics, Kyocera and An Overview of Weibull Analysis, Indium Corporation, December 2012.
  • Lead-free Assembly for High Yields and Reliability, APEX, February 2013, San Diego, CA.
  • Tin Whiskers: 101, SMTA Medical Electronics Symposium, Nov 13, 2013, Milpitas, CA.
  • Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing, IPC Conf on Solder and Reliability, Nov 14, 2013, Costa Mesa, CA.
  • Risk and Mitigation for Tin Whiskers and Tin Pest, SMTAI, October 2014, Chicago, IL.

Chairing of Technical Sessions

  • NEPCON West 1998
  • NEPCON West 1999
  • APEX 2000
  • APEX 2001
  • APEX 2002
  • APEX 2003
  • SMTAI 2002
  • SMTAI 2008
  • IMAPS 2012
  • IMAPS New England 2013
  • IMAPS 2013

Process Consultations

  • Ericsson 1997 resulted in productivity enhancement of 10% yielding over $50M in increased profit
  • Blaupunkt, 1999 resulted in 15% productivity improvement
  • Flextronics, Guadalajara, 2000, resulted in a 5% productivity improvement
  • Jabil, Guadalajara, 2001, resulted in a 25% yield improvement
  • Leitch 2002, resulting in 8% productivity improvement

Books Published

  • D. P. Seraphim, R. C. Lasky, C. Y. Li, Principles of Electronic Packaging, McGraw-Hill, 1989, NY, NY.
  • R. C. Lasky, D. Stigliani, U. Osterberg, Optoelectronics for Data Communication, Academic Press, 1995, NY, NY.
  • C. DeCusatis, E. Maass, D. Clement, R. C. Lasky, Handbook of Fiber Optic Data Communication, Academic Press, 1997, NY, NY.
  • R. C. Lasky, Beyond a Reasonable Doubt: Evidence for a Designed Universe, 1st Books, 2000.
  • R.C. Lasky, The Adventures of Patty and the Professor, ISBN: 978-0-615-57887-4, Indium Corporation, Clinton, NY, 2012.
  • R.C. Lasky, W.J. Hall, etal, Handbook of Electronic Assembly and Guide to SMTA Certification, ISBN:978-0-9888873-1-2, SMTA, 2014.

Process Software

Affiliations

  • IEEE
  • IMAPS
  • SMTA
  • MRS
  • Bomische Physical Society
  • Member of the NOI’s Scientific Advisory Committee 1992-95, Quebec City

Patents

  • Number 5,631,987: Low Cost, Mode Filed Matched, High Performance, Laser Transmitter Optical Subassembly.
  • Number 6,572,702: High Speed Electronic Assembly System and Method.
  • Twelve patent publications in materials, materials analysis and, electronic packaging.

Ronald C. Lasky, PhD, PE's Technical Documents

Ronald C. Lasky, PhD, PE's Blog Posts

A Precise Equation Relating Karats of Gold to Density in Gold Alloys

29 Nov 2018 by Dr. Ron Lasky [view bio]

Dr. Ron received a question asking him to verify a calculation used to determine the karat value of various gold-based alloys. It's not as simple as it appears. Read this post to see how Dr. Ron answers the question.

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Patty and the Professor Flashback: Uptime Part 4

28 Oct 2018 by Dr. Ron Lasky [view bio]

Folks, the adventures of The Professor continue. This blog post is a must-read if you are concerned about improving electronics assembly line productivity and uptime.

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The Professor's second visit to ACME..... continued

21 Oct 2018 by Dr. Ron Lasky [view bio]

The Professor shows Acme how to increase profitability even with a $5.00 increase in pay by keeping their electronics assembly line running through the lunch break. Here's how.

Read More

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