Indium Corporation’s silver sintering pastes are high metal-loading materials designed to fit easily into a dispense process with no change of deposition equipment. The pastes can also use fast “reflow-like” (RFL) sintering processes to form strong joints on many standard leadframe, DBC, and IPM pad finishes, and will bond strongly to die with Ag, Au, or Cu surfaces.
Solder and many standard epoxy-silver materials are proving increasingly unsuitable for many discrete and small module device applications. They may, for example, be incapable of surviving the ambient conditions seen from longer mission profiles for automotive applications. These mission profiles typically drive longer high-temperature operating life (HTOL) and larger temperature swings in usage (thermally cycling).
Quicksinter® Silver Sintering Pastes Features & Benefits
- Proven fast sintering with excellent joint strength
- Pressureless sintering solution with pressurized sintering capabilities
- Controllable bondline thickness from 30-70µm
- Versatile sintering profiles
- Voiding <1%*
- Porosity <30%*
Average on most application runs
What is Sintering
- Metal sintering is the interdiffusion of surface atoms on adjacent metal particles to create an open network of tiny microvoids, versus traditional solder which melts (reflows) completely
- Temperature, pressure, time, and nature of the sintering atmosphere are the primary factors controlling densification and joint strength
- It is often the process of choice for forming joints involving materials with high melting points
Why Silver Sintering?
- High reliability
- Highest electrical conductivity
- High thermal conductivity
- Higher than Cu
- High temperature applications
- Less reactive than Cu