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Durafuse^™ LT

Durafuse^™ LT is a patent pending low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C.

Durafuse^™ LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process setup. Durafuse^™ LT is made up of a low-melting indium-containing alloy and a higher-melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. Durafuse^™ LT is ideal for high-reliability applications, which utilize thermally sensitive components or boards and/or have a requirement for step soldering.

Features & Benefits

Drop Shock – Performance is more than two orders of magnitude better than Bi-containing low-temperature materials
Drop Shock - Performance is equal or better than SAC305 with proper process optimization
Ideal for step soldering and low temperature requirements

Mexico Technology Award, October 2020

Electronics Manufacturing (EM) Innovation Award, July 2020

CIRCUITS ASSEMBLY New Product Introduction (NPI) Award, February 2020

Durafuse^™ LT

Obtains the benefits of low-temperature processing reduced warpage and other negative effects on substrates and components without sacrificing reliability.

Dropping electronics is a fact of life. Durafuse<sup>™</sup> LT allows for end-product durability.

Low-Temperature Solder
Innovation

Durafuse^™ LT and the Low- to Mid-Temperature Solder Space

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Improving Drop Shock Resistance

Drop Shock (44g ball at 500mm drop height)

Fusion Time vs. Drop Shock Performance: Depending on peak temperature, time at peak can be used to optimize for drop-shock resilience.

Low Temp Alloy Technology

Durafuse^™ LT contains a low-melting indium-based alloy which initiates joint fusion, while the high-melting SAC alloy provides enhanced strength and durability

Step Soldering

Meeting requirements for step soldering, particularly in RF shield attachment and rework applications
- Peak reflow temperature between 200^°C and 210^°C
- Shear strength retained above 150^°C

Durafuse^™ LT Recommended Reflow

Optimization of the reflow profile with a plateau at peak temperature is essential for maximizing drop shock reliability

A 200^°C peak reflow temperature requires a longer plateau region
Increasing peak temperature to 205 or 210^°C allows for reduced reflow time
This profile is a general guideline in establishing a reflow profile for Durafuse^™ LT in Indium5.7LT-1

Related Applications

Mobile

Handheld mobile devices are facing higher demands than ever – better cameras, better displays, and better battery life – all compacted into increasingly smaller spaces. Indium Corporation delivers products that can help you overcome these fine feature challenges.

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Electronics assembly is one of the fastest changing, most demanding markets on the planet. As the electronics industry evolves to increasingly smaller, sophisticated, and more powerful devices, Indium Corporation continues to provide leading-edge materials and technology to solve today’s and tomorrow’s assembly challenges.

Medical

High-reliability medical devices demand high-reliability materials. Indium Corporation offers a wide variety of products, including gold-alloy solder preforms, paste, solder wire, and solder sphere materials that are resistant to oxidation formation and corrosion, ensuring product reliability.

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Durafuse^™ LT

The tough choice that is easy to make.

Durafuse^™ LT

Durafuse^™ LT is a patent pending low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C.

Features & Benefits

Mexico Technology Award, October 2020

Electronics Manufacturing (EM) Innovation Award, July 2020

CIRCUITS ASSEMBLY New Product Introduction (NPI) Award, February 2020

Durafuse^™ LT

Obtains the benefits of low-temperature processing reduced warpage and other negative effects on substrates and components without sacrificing reliability.