Introducing Indalloy®301LT, a next-generation low-temperature solder alloy engineered specifically for package-attach applications. With a focus on reduced processing temperatures and enhanced performance, this cutting-edge solution addresses the key challenges in modern power module soldering.
Read MoreFolks, Join me at the SMTA Harsh Environments Conference in Amsterdam, The Netherlands on May 23 to May 25, 2023. I will be giving a presentation on “Rec...
Read MoreAs energy consumption has become increasingly important—in terms of cost, availability, and environmental impact—it is about time we use quantitative data to consider carbon emissions and oven energy consumption to make process decisions.
Read MoreManaging ΔT during reflow is an important part of a well controlled process. Durafuse™ LT provides the extra flexibility for process control and reliabilty on large boards.
Read MoreFolks, Soldering is one of the oldest technologies developed by humankind, perhaps as long as 6,000 years ago. Early uses were in the making of jewelry, cookware, ...
Read MoreDurafuse® LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process setup. Durafuse® LT is made up of a low-melting indium-containing alloy and a higher-melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. Durafuse® LT is ideal for high-reliability applications, which utilize thermally sensitive components or boards and/or have a requirement for step soldering.
44g ball at 500mm drop height
Peak temperature and time at peak can be used to optimize for drop shock resilience
Durafuse® LT contains a low-melting indium-based alloy which initiates joint fusion, while the high-melting SAC alloy provides enhanced strength and durability
Optimization of the reflow profile with a plateau at peak temperature is essential for maximizing drop shock reliability
Handheld mobile devices are facing higher demands than ever – better cameras, better displays, and better battery life – all compacted into increasingly smaller spaces. Indium Corporation delivers products that can help you overcome these fine feature challenges.
Electronics assembly is one of the fastest changing, most demanding markets on the planet. As the electronics industry evolves to increasingly smaller, sophisticated, and more powerful devices, Indium Corporation continues to provide leading-edge materials and technology to solve today’s and tomorrow’s assembly challenges.
High-reliability medical devices demand high-reliability materials. Indium Corporation offers a wide variety of products, including gold-alloy solder preforms, paste, solder wire, and solder sphere materials that are resistant to oxidation formation and corrosion, ensuring product reliability.
