产品 合金 Durafuse® LT

Durafuse®LT

Durafuse® LT is a patented low- to mid-temperature mixed solder alloy system developed by Indium Corporation, specifically designed for high-reliability applications that require a lower reflow temperature. Leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) have embraced this versatile solder paste technology for various high-reliability applications, attracted by its numerous advantages and strengths.

技术支持:铟泰公司

  • 低温至中温
  • 从 205°C 或更高温度回流
  • High-Reliability
该图示包含“Durafuse LT”和“Durafuse 110”的标志、焊料产品,以及突出显示低温、“节能”和可靠性”等特点的图标。

Drop Shock Reliability

Durafuse®LT 具有更强的抗跌落冲击能力,性能优于铋锡(BiSn)或铋锡银(BiSnAg)合金,在采用最佳工艺设置的情况下,性能优于 SAC305。

Thermal Cycling Reliability

Durafuse® LT provides unmatched ductility and exceptional TCT performance when reflowed at 220-245°C. Unlike conventional high-reliability solder pastes, which are rigid and susceptible to cracking, this solder paste offers distinct advantages in wafer-level CSP assembly. It effectively reduces quad-flat no-leads (QFN) cracks, thus enhancing durability and performance in challenging applications.

可持续性

Our research has shown that by implementing Durafuse® LT, customers can achieve energy savings of up to 15% and reduce their carbon footprint to meet global sustainability requirements.

Applications with Large Temperature Gradients

When dealing with assembly applications that experience significant temperature differentials (large ΔT) and require varying reflow temperatures while maintaining solder joint reliability, Durafuse® LT provides a broad process range of 205°C or higher. This wide window simplifies the handling of complex designs.

Two green containers labeled "Durafuse LT 110" by Indium Corporation stand prominently against a plain background.

Durafuse®LT 产品

Adopted by leading OEMs and EMSs, the award-winning Durafuse® LT has been successful since its launch. This solder paste utilizes a range of both proven and novel flux formulas that demonstrate excellent performance. Additionally, we offer two other products in the Durafuse® line to cater to various requirements, including high-temperature Pb-free options and high-reliability solutions with low voiding.

产品数据表

Durafuse® LT with Indium10.2HFA Low-Temp Drop Shock Solution PDS 100122 R0.pdf
Durafuse®LT含铟3.2HF PDS 100303 R0.pdf
Durafuse® LT 195 Low-Temperature Drop Shock Solution PDS 99991 R2.pdf
Durafuse®LT低温 Indium10.8HF) PDS 99797 R8.pdf

相关应用

Durafuse® LT’s low-temperature capabilities are available for use in a variety of applications.

印刷电路板板上的微芯片

PCB

经过验证且处于行业前沿PCB 组装材料PCB

低温

低温

Transform your operations with our low-temp soldering…

相关市场

Durafuse® LT is used in markets that require high reliability, particularly those involving thermally sensitive components or boards. It’s ideal for step soldering and is often utilized in a variety of applications and industries.

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