金(Au)
Gold Alloy Solder Paste
Gold-tin solder paste is used in a variety of applications that require a melting temperature over 150°C, good thermal fatigue properties, and high-temperature strength. It is widely used in military, aerospace, high-power LED, and medical applications.
技术支持:铟泰公司
- 卓越的热导率
- Good Joint Strength
- Excellent Wetting Properties

产品概览
Gold-Tin (AuSn) Alloy Solder Solutions
Indium Corporation offers a comprehensive range of gold-tin (AuSn) alloys, including:
- 80Au20Sn
- 79Au21Sn
- 78Au22Sn
- 77Au23Sn
These alloys are ideal for high-reliability applications requiring excellent performance, thermal conductivity, and durability.
颗粒大小和金属负载
Gold-tin solder paste is offered in powder sizes ranging from 2 to 7 C. Metal loadings vary between 91% to 94%, depending on the desired application method and particle size.
金硒焊膏助焊剂选项
Our gold-tin alloy solder paste is available with a variety of flux vehicles to meet specific application needs:
No-clean Flux:
- AuLTRA® 5.1 (used in high-power LED and MEMs applications)
- AuLTRA® 5.1LS (utmost slump resistance)
- Indium10.8HF (accommodates higher processing temperatures required by the electronics industry)
- RMA-SMQ51A (for difficult to solder surfaces in die-attach)
- NC-SMQ75 (halogen-free and low-residue; requires <10 ppm oxygen)
Water-wash Flux:
- AuLTRA® 3.2 (used in high-power LED applications)
- 铟3.2HF
包装选项
Our gold-tin solder paste is available in convenient packaging options, including:
- 10cc and 30cc syringes for easy dispensing
- 可根据要求定制包装
产品数据表
AuLTRA® 3.2 AuSn Water-Soluble Solder Paste PDS 99986 R2.pdf
AuLTRA® 5.1 AuSn No-Clean Solder Paste PDS 99987 R3.pdf
AuLTRA® 5.1LS Low-Slump AuSn No-Clean Solder Paste PDS 100153 R1.pdf
相关应用
Gold alloy solder pastes are available for use in a variety of applications.
相关市场
铟泰公司 领先的金(Au) ,为以下领域提供适用于高温、可靠性及关键应用 (应用 芯片和密闭 )的解决方案:
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