Products Gold Solder Gold Alloy Solder Pastes

Gold Alloy Solder Paste

Gold-tin solder paste is used in a variety of applications that require a melting temperature over 150°C, good thermal fatigue properties, and high-temperature strength. It is widely used in military, aerospace, high-power LED, and medical applications.

技术支持:铟泰公司

  • 卓越的热导率
  • Good Joint Strength
  • Excellent Wetting Properties
金(Au) 合金  金(Au)-锡焊膏

Gold-Tin (AuSn) Alloy Solder Solutions

Indium Corporation offers a comprehensive range of gold-tin (AuSn) alloys, including:

  • 80Au20Sn
  • 79Au21Sn
  • 78Au22Sn
  • 77Au23Sn

These alloys are ideal for high-reliability applications requiring excellent performance, thermal conductivity, and durability.

颗粒大小和金属负载

Gold-tin solder paste is offered in powder sizes ranging from 2 to 7 C. Metal loadings vary between 91% to 94%, depending on the desired application method and particle size.

金硒焊膏助焊剂选项

Our gold-tin alloy solder paste is available with a variety of flux vehicles to meet specific application needs:

No-clean Flux:

  • AuLTRA® 5.1 (used in high-power LED and MEMs applications)
  • AuLTRA® 5.1LS (utmost slump resistance)
  • Indium10.8HF (accommodates higher processing temperatures required by the electronics industry)
  • RMA-SMQ51A (for difficult to solder surfaces in die-attach)
  • NC-SMQ75 (halogen-free and low-residue; requires <10 ppm oxygen)

Water-wash Flux:

  • AuLTRA® 3.2 (used in high-power LED applications)
  • 铟3.2HF

包装选项

Our gold-tin solder paste is available in convenient packaging options, including:

  • 10cc and 30cc syringes for easy dispensing
  • 可根据要求定制包装

产品数据表

AuLTRA® 3.2 AuSn Water-Soluble Solder Paste PDS 99986 R2.pdf
AuLTRA® 5.1 AuSn No-Clean Solder Paste PDS 99987 R3.pdf
AuLTRA® 5.1LS Low-Slump AuSn No-Clean Solder Paste PDS 100153 R1.pdf

相关应用

Gold alloy solder pastes are available for use in a variety of applications.

高温焊接

高温焊接

为关键应用提供耐高温焊接材料应用

Microchip being inserted onto PCB

High-Reliability

Various options for various high-reliability PCBA applications.

机器人手臂芯片 对半导体芯片 精密焊接的特写镜头,展示了先进的芯片 焊接层 。

芯片

芯片解决方案包括用于金(Au)基…的焊膏……

相关市场

铟泰公司 领先的金(Au) ,为以下领域提供适用于高温、可靠性及关键应用 (应用 芯片和密闭 )的解决方案:

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