应用
热管理
Semiconductor packages for high-performance computing (HPC) face escalating heat dissipation demands. Advanced packaging methods used in CPUs, GPUs, ASICs, and FPGAs require enhanced thermal and reliability features due to rising power density. Learn how Indium Corporation’s comprehensive approach to thermal materials extends to optimal solutions for product longevity, reliability, and assembly processes.
概述
Metallic TIMs for Ultra-High Power Density
Ensuring proper thermal management is essential for the efficiency and reliability of semiconductor-based systems. Discover the advantages of our advanced metal-based TIM solutions, designed for long-lasting, optimized thermal performance that easily fits into your manufacturing processes.
益处
Metal-Based TIMs: The Obvious Choice for High-Performance Computing
长期可靠性
Metal-based TIMs provide stable thermal resistance beyond time zero.
Excellent Surface Wetting
Metal-based TIMs flow and wet to most surfaces, effectively reducing the contact thermal resistance between mating surfaces.
适用于高翘曲的兼容材料
由于 CTE 值不同，金属基 TIM 符合非共面表面。
易于安装
提供多种包装选项，可在自动装配系统中即插即用。
Thermal Management Products
Choosing a TIM based only on thermal performance isn’t enough for today’s advanced devices. Let Indium Corporation help you find the right solution from our wide range of standard and customized options, perfectly suited to your specific application needs.
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Indium Corporation’s metal-based thermal interface materials are designed to cater to a wide range of markets.
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