应用
基底/垫片-连接
In power module assemblies, the substrate serves as the thermomechanical foundation, supporting active devices and interconnects. Traditionally, the substrate is attached to a baseplate. However, alternative methods, such as Dual-Side Cooling, use a spacer to provide both mechanical support and efficient heat dissipation. Both approaches face challenges such as thermal and mechanical stress, warpage, and CTE mismatch, making the choice of reliable substrate-attach materials critical.
概述
实现设计目标的成熟材料技术
Indium Corporation’s solder preforms feature a range of proven technologies, including InFORMS® reinforced preforms and the highly reliable Indalloy® 276. These materials are recognized as the premier substrate-attach solutions, widely utilized throughout the power module industry.
益处
Indium Corporation’s Substrate-Attach Materials Offer the Following:
Semiconductor assembly involves the process of packaging and interconnecting semiconductor chips or integrated circuits onto a substrate to create functional electronic devices.
延长设备寿命
精密设计控制
低温选项
无缝集成
易用性
相关产品
我们的产品久经考验，可帮助各行各业的客户通过可靠的产品提高产量，缩短产品上市时间。
增强型焊片
InFORMS® 增强型焊片 焊点的可靠性
焊片
焊片：用途广泛的材料，可解决密封及……
Indalloy®276
一种无铅焊料，可靠性 ……
InTACK®
Power electronics assembly, tacking agent, no-clean, no-residue,…
相关应用
电力电子产品包装与装配
种类齐全、经过验证的高可靠性 和……
High-Reliability
Various options for various high-reliability PCBA applications.
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