浸入式冷却

A new era for data centers is here—driven by enhanced energy efficiency and sustainability through immersion cooling. Material compatibility with immersion fluids is critical in both single- and two-phase systems. Indium Corporation’s Heat-Spring® solutions deliver reliable thermal interface material for top performance in both immersion fluid types.

一张微芯片的特写照片,芯片上方覆盖着一层导热垫,并放置在电路板板上。

High Thermal Conductivity

With indium Heat-Spring®, thermal conductivity can reach up to 86W/mK.

Application Expertise

With over 90 years of experience in indium application and manufacturing, we are a proven leader in the industry.

不可解体

Heat-Spring® will not dissolve in either single-phase or two-phase immersion cooling liquid.

Compressible

特殊的图案设计可降低接触电阻。

相关应用

一张电路板 上的计算机微芯片特写电路板 可见电子元器件 电路图案。

热管理

面向高性能计算(HPC)的散热解决方案,确保可靠性

一张带有透明覆盖层的微芯片插图,展示了内部元器件 电子连接,突显了其堪比腕表设计的精密程度。

计时器 1、计时器 1.5、计时器 2

金属基热界面材料(TIM)具有出色的导热性能,并且……

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