SOLDER PREFORMS

瓶坯合金

Solder preforms come in standard shapes such as squares, rectangles, washers, and discs. Typical sizes range from 0.010″(0.254 mm) up to 2″(50.8 mm), though smaller and larger sizes, as well as custom shapes, are also available. Dimensions can be held to tighter tolerances to assure volume accuracy.

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选择合金

A wide assortment of alloys is available in liquidus temperatures that range from 47°C to 1,063°C. Alloys can be indium-containing, gold-containing, lead-free, fusible or standard lead, as well as many others.

选择安全的熔融指数

A general rule is to select an alloy that melts at least 50°C higher than the operational temperature of the part being soldered.

确保材料的兼容性

Consider the materials being soldered and what solder is most compatible. For example, tin-based solders will scavenge the gold from gold-plated parts, forming brittle intermetallics, so indium-based solders are generally recommended in these cases.

考虑瓶坯形状

It is important to consider the shape of the final preform in the alloy selection process, as metals and alloys have unique characteristics that effect malleability.

评估运行条件

组装完成后的运行环境也是一个重要的考虑因素。它是否会在极高或极低的温度下运行，和/或受到振动？

尺寸规格

The location of the solder joint and the required solder volume dictate the preform’s size and shape. Once flat dimensions (diameter, length, and width) are set, adjust thickness to achieve the needed volume. For through-hole connections, add 10-20% to the calculated volume to achieve a good fillet, while pad-to-pad joints should have about 5% less surface area than the pad.

Each solder preform should have a specified burr tolerance. Adhering to standard tolerances helps avoid extra costs and delays. Indium Corporation offers an extensive library of preform sizes and shapes, or we can create custom setups for your application. Choosing an existing preform size can help save setup time.

Width/Length or Diameter	典型公差
Up to 0.100″ (2.54 mm)	± 0.002″ (± 0.051 mm)
Over 0.100″ (2.54 mm)	± 0.005″ (± 0.127 mm)

厚度	典型公差
Up to 0.001″ (0.025 mm)	± 0.0002″ (± 0.005 mm)
0.001″ (0.025mm) to 0.002″ (0.050 mm)	± 0.0003″ (± 0.0076 mm)
> 0.002″ (0.050mm) to 0.010″ (0.254 mm)	± 0.0005″ (± 0.0127 mm)
> 0.010″ (0.254mm) to 0.020″ (0.508 mm)	± 0.0010″ (± 0.0254 mm)
> 0.020″ (0.508mm) to 0.050″ (1.27 mm)	± 0.0025″ (± 0.0635 mm)
> 0.050″ (1.27 mm)	± 5%

毛刺公差（圆盘、方形和矩形）	典型公差
< 0.050″ (1.27 mm)	0.002″ (0.050 mm)
> 0.050″ (1.27 mm) to 0.500″ (12.7 mm)	0.003″ (0.076 mm)
> 0.500″ (12.7 mm)	0.005″ (0.127 mm)

毛刺公差（垫圈和框架）	典型公差
< 0.100″ (2.54 mm)	0.003″ (0.076 mm)
厚度≥ 内径的 2/3 时	0.005″ (0.127 mm)

Solder Preform Recommendations

包装

There are a variety of packaging options, including tape & reel. To minimize excessive handling, exposure to air, and subsequent oxidation, solder preforms should be packaged according to the quantity used during a typical work shift.

存储

Keep in the original container, closed securely, in 55% RH or less and at temperatures below 22°C. Solder preforms can also be stored in an inert atmosphere, such as a nitrogen dry box.

Shelf Life

The shelf life of solder preforms is dependent on the alloy composition. Pb-free alloys and alloys with less than 70% lead content have a shelf life of 1 year from the date of manufacture (DOM). Alloys with more than 70% lead content have a shelf life of 6 months from the DOM.