纳米箔
NanoFoil® is a versatile reactive multi-layer foil that delivers instantaneous heat for a wide range of applications across numerous industries, including semiconductor, aerospace, automotive, electronics, biomedical, and defense. As a reliable heat source, NanoFoil® offers predictable and controllable heating, enabling localized soldering without subjecting surrounding components to unwanted heat exposure.
技术支持：铟泰公司
- 室温下即时精确焊接
- 通用焊接兼容性
- 促进无助熔剂焊接
产品概览
所需的可焊接表面
标准和镀锡纳米箔
NanoFoil® is a localized heat source that enables material joining below 450°C and is available in two options: standard, which is used with solder preforms or coated surfaces, and tin-plated, which features 10 μm of pure tin on both sides for direct bonding to solderable surfaces.
多层反应箔
Vapor-deposited layers of aluminum and nickel deliver up to 1,500°C of localized heat in milliseconds, activated by a small energy pulse—ideal for rapid, precise bonding and reaction initiation.
NanoFoil®激活
NanoFoil® 可以通过使用光、电或热源施加小脉冲局部能量来激活。在特定点施加能量与施加总能量同样重要。
特点
NanoBond® is the process of bonding two components with solder using NanoFoil® as a heat source. When activated, the foil creates a self-sustaining reaction that acts as a rapid and controllable localized heat source to melt adjoining solder layers, bonding components together.
1,350°–1,500°C (2,460°–2,730°F)
最高反应温度
6.5-8 米/秒
反应速度
1,050-1,250J/g
反应热
35-50W/mK
Thermal Conductivity
NanoFoil®规格建议
NanoFoil® is offered in standard sheet form, 43″ x 9″, or can be customized to meet your specifications with sizes as small as 1 mm x 1 mm. It is available in two thicknesses: 40 μm and 60 μm. Plus, NanoFoil® can be enhanced with a tin plating option, featuring a 10 μm layer of pure tin on both sides. This tin-plated NanoFoil® only requires solderable surfaces for effective bonding.
| 推荐的NanoFoil | 组件 #1 电镀 | 组件 #2 电镀 |
|---|---|---|
| 镀锡 | ENIG, Au, Ag | ENIG, Au, Ag |
| 镀锡 | ENIG, Au, Ag | 镀锡 |
| Standard using solder preforms* | ENIG, Au, Ag | ENIG, Au, Ag |
| 标准 | 镀锡 | 镀锡 |
*Solder preforms can be used with NanoFoil® and appropriate surfaces.
产品数据表
NanoFoil®PDS 98569 R4.pdf
相关应用
NanoFoil® is suitable for a variety of industry-related applications.
电力电子产品包装与装配
种类齐全、经过验证的高可靠性 和……
热管理
面向高性能计算（HPC）的散热解决方案，确保可靠性
相关市场
Indium Corporation’s NanoFoil® is available for use in a wide range of markets.
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