烧结材料
无压烧结
Pressureless sintering is a versatile bonding process used in applications where high conductivity interconnections are critical. Sintered silver or sintered copper bonds offer excellent thermal and electrical conductivity and can withstand high operating temperatures well in excess of 175°C. Pressureless sintering can also be utilized as a Pb-free alternative to traditional die-attach solders. Indium Corporation provides both silver and copper pressureless sinter pastes for a variety of applications.
技术支持：铟泰公司
- 高金属/低有机配方
- Ag and Cu Sinter Options
- 低温 200°C 烧结（银）
产品概览
适用于各种表面处理
Our pressureless silver (Ag) sinter paste is compatible with Ag, gold (Au), and copper (Cu) surfaces, while the Cu sinter paste suits Cu, Au, Ni, and Ag surfaces.
适合高温环境
With melting points of 961°C for Ag and 1,084°C for Cu, sintering is the perfect solution for applications where operating temperatures may exceed 175°C.
Lead-Free Die Attach Solution
Pressureless sintering offers a lead-free alternative to traditional Pb-based high-temperature solder pastes for semiconductor die attachment.
低加工温度
Pressureless sintering operates as a function of temperature over time. Indium Corporation’s Ag sinter paste can be processed at temperatures as low as 200°C.
无压烧结产品
QuickSINTER
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InBAKE™
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产品数据表
QuickSinter® QS815-AR Pressureless and Pressure Silver Sintering Paste PDS 99780 R1.pdf
QuickSinter®QS815-SD Pressureless Silver Sintering Paste PDS 99781 R1.pdf
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烧结材料
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