焊膏
半导体焊膏
Indium Corporation is a trusted partner to our customers focused on semiconductor packaging. Our diverse portfolio of solder pastes caters to a variety of semiconductor package types, targeted for a wide range of applications and markets. Indium Corporation’s semiconductor solder pastes meet the diverse needs in semiconductor packaging assembly, including precision fine-feature printing, dispensing and jetting for SiP and MEMS packaging, as well as high melting temperature solders for die-attach and clip-attach in power semiconductor packaging.
技术支持：铟泰公司
- 完整作品集
- 大量合金选择
- Advanced Solder Powder Technology
产品概览
作为一家值得信赖的制造企业，我们的产品专为满足您的半导体封装要求而设计。利用我们广泛的助焊剂化学成分和合金，在我们经验丰富的技术团队的支持下，实现最佳性能。
合作伙伴资格
Mycronic has qualified the Picoshot® series for jetting applications. This series includes Type 5 and Type 6 options, both no-clean and water-wash, with further development and qualification in progress.
高温无铅
Introducing the Durafuse® HT, a drop-in Pb-free solution for replacing Pb-containing solders in high-temperature applications.
20 年
Our SMQ75 high-temperature, high-Pb paste, with over 20 years of industry history, continues to be the standard standard for die-attach in lead frame applications.
50 亿美元
To date, more than 5 billion front-end SiP modules have been manufactured using Indium Corporation’s semiconductor materials, and we anticipate continued growth.
半导体焊膏产品
Indium Corporation offers a comprehensive portfolio that includes standard no-clean and ultra-low-residue no-clean fluxes, water-wash chemistry, and new fluxless technology. Choose from a wide variety of alloys that cover low-, mid-, and high-melting temperatures. Equipped with advanced solder powder manufacturing technology, we produce round, low-oxide powder with precise distribution for optimal performance.
Die-Attach Paste
| 焊膏 | 助焊剂类型 | Halogen-Free | 应用 | Comments |
|---|---|---|---|---|
| NC-SMQ75 with high-Pb solder alloys | (OR) Organic acid based Ultra-low residue – ULR | 是 | Printing or Dispensing | Industry leading die-attach paste for high-Pb. Post reflow residue <1% of paste weight |
| Indium9.72HF with high-Pb and HTLF solder alloys | (RO) Rosin based | 是 | Printing or Dispensing | Low voiding with wide reflow process window |
| NC-SMQ51SC with high-Pb, Pb-free and AuSn solder alloys | (RO) Rosin based | 是 | Printing or Dispensing | Superior wetting, low voiding. Suitable for a wide range of alloys |
| Durafuse® HT High Temperature Pb-free (HTLF) solder | Various | Yes* | Printing or Dispensing | Pb-free alternative to high-Pb solder for power discrete die-attach |
| FAST Paste (Fluxless) with high-Pb and Pb-free solder alloys | (OR) Flux-less, solvent based binder | 是 | Printing or Dispensing | Flux-less solder paste designed for reflow under formic acid (HCOOH) |
Jetting and Microdispensing Paste
| 焊膏 | 助焊剂类型 | Halogen-Free | 应用 | Comments |
|---|---|---|---|---|
| PicoShot®WS-5M | 水洗 | 是 | 喷射 | For dot jetting of 300 µm diameter and above, and fine-line dispensing for metal lid-attach |
| PicoShot®NC-5M | Solvent- or aqueous-based chemistry or no-clean | 是 | 喷射 | For dot jetting of 230-280 µm diameter, and fine-line dispensing for metal lid-attach |
| 铟12.8HF | Solvent- or aqueous-based chemistry or no-clean | 是 | Jetting and Microdispensing | For dot jetting down to 80 µm diameter and above, and fine-line dispensing for metal lid-attach |
| 铟6.6HF-HD | 水洗 | 是 | Jetting and Microdispensing | Water-washable jetting and fine-line dispensing paste |
SiPaste®焊膏
| SiPaste® | 助焊剂类型 | Halogen-Free | 应用 | Comments |
|---|---|---|---|---|
| SiPaste®3.2HF | 水洗 | 是 | Type 6 and Type 7 solder paste suitable for ultrafine-pitch printing | Best all-around pure water-soluble paste |
| SiPaste®C201HF | 去离子水 + 皂化剂或半水化学制剂 | 是 | Type 6 and Type 7 solder paste suitable for ultrafine-pitch printing | Good wetting power and HiP mitigation |
| SiPaste®C312HF | DI water + saponifier, semi-aqueous chemistry, or no-clean | 是 | Type 6, Type 7, and Type 8 solder paste suitable for ultrafine-pitch printing | Best-in-class transfer efficiency and stencil life; best all-around fine-feature paste |
| SiPaste®SMQ77 | No-clean | 是 | Type 6 solder paste suitable for ultrafine-pitch printing | No-clean, ultra-low residue process that is compatible with post-reflow underfill |
半导体焊膏
Fine Powder Pastes
Semiconductor Solder Pastes Fine Powder Solder Pastes…
高温焊膏
Pb or Pb-free high-temperature solder pastes.
PicoShot®系列
Jetting Paste developed with Mycronic for trusted…
相关市场
相关产品
Fine Powder Pastes
Semiconductor Solder Pastes Fine Powder Solder Pastes…
高温焊膏
Pb or Pb-free high-temperature solder pastes.
Durafuse®技术
一项*专利产品 合金 ，可实现……
专家支持，结果可靠
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