Development of Innovative Advanced Packaging Materials for System in Package
Methodical development, proper selection, and application of advanced packaging materials for the various assembly processes are crucial to ensuring h...
Dongkai Shangguan's Blog
Digital and Physical: Thermal Twins for Developing Thermal Management Solutions
As we all know, finding thermal management solutions is becoming an increasingly critical but also an ever more challenging issue for the semiconducto...
Thermal Test Chips (TTCs) for Advanced Semiconductor Packaging
Thermal management is becoming an ever more critical challenge for semiconductor devices, as the functional density and power density increase &n...
ML/AI in Semiconductor Packaging and Electronics Manufacturing
As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manuf...
Interconnect Reliability: From the Chip to the System
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip ...
Adaptive Control: The "Holy Grail" in Semiconductor Smart Manufacturing
Artificial intelligence and machine learning (AI/ML) can have various applications in smart manufacturing for semiconductor fab, advanced pa...
Materials Science Solutions for Electronics Sustainability
This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenie...