Indium Blog

SPIE Photonics West 2024

  • AuSn
  • Die Attach
  • Gold Solder
  • Package Attach

  • Indium Corporation® had the privilege of exhibiting at the world’s premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics, SPIE Photonics West, Jan. 30-Feb. 1, in San Francisco. It was such a great experience and exciting to learn about all the new applications in this innovative market, and to network with our colleagues, and customers.

    The Moscone Center in San Francisco had over 24,000 technical professionals registered from more than 70 countries. SPIE hosted more than 1,500 exhibitors, and featured over 5,000 technical presentations throughout the week that included BiOS, LASE, OPTO, Quantum West, the BiOS Expo, the Photonics West exhibition, the Quantum West Expo, and the co-located AR|VR|MR conference and exhibition.

    As a leading solder supplier for laser and optical applications, Indium Corporation® promoted the following high-performance gold-based alloy solutions:

    Precision Die-Attach (PDA) Preforms: Ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end-product. Indium Corporation's Au-based PDA preforms offer the NEW Gold Standard – the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:

    • Highly accurate thickness control
    • Precise edge quality
    • Optimized cleanliness
    • Default waffle pack method
    • Available for gold-based alloys

    AuLTRA® ThInFORMS®: Premium 80Au/20Sn ultra-thin preforms, only 0.00035"-thick (0.00889mm or 8.89μm) that improve the overall operational efficiency of high-output lasers. AuLTRA® ThInFORMS® help combat common issues such as:

    • Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting.
    • Poor thermal transfer—the ultra-thin 0.00035" preform reduces bondline thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device.

    AuLTRA®75: An off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. The AuLTRA® product line also comes in 78Au/22Sn and 79Au/21Sn compositions.

    AuLTRA® Fine Ribbon: 80Au/20Sn continuous length ribbon with 0.010" width and 0.0006" thick capabilities, ideal for use in automatic die-bonding machines.

    Indium Corporation's gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most used gold-based alloy is 80Au/20Sn; it is the pillar alloy of the microelectronics industry with a melting point of 280°C and works exceptionally well in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporation's AuSn solder offers numerous benefits including:

    • Highest tensile strength of any solder
    • High melting point compatible with subsequent reflow processes
    • Superior thermal conductivity
    • Resistance to corrosion

    To learn more about Indium Corporation's precision Au-based preforms, visit

    Thank you to everyone who visited our booth and we look forward to seeing you all at SPIE Photonics West 2025!