Gold Paste
Gold-tin solder paste is used in a variety of high-reliability applications, where its high melting point, non-creep, high-tensile stress, thermal and electrical conductivity, as well as proven usage life makes it a standard "known-good" material.
Related Gold Paste Blog Articles
How does AuSn alloy and flux impact the reliability of solder paste?
When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-eutectic) and the correct flux for the application are two of these.
Read MoreWhy is AuSn powder size important for solder paste application?
Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. This blog post reviews Indium Corporation's capabilities for making smaller AuSn particle sizes.
Read MoreCome See Me at High-Temp Electronics Network Show in Oxford, UK
We’re featuring our Au solder product line and braze materials at the High-Temperature Electronics Network (HiTEN 2019) at St. Anne’s College in Oxford, UK.
Read MoreFeatures & Benefits
- Highest tensile strength of any solder
- High melting point is compatible with subsequent reflow processes
- Pb-free
- Superior thermal conductivity
- Resistance to corrosion
- Superior thermal fatigue resistance
- Good joint strength
- Excellent wetting properties
- Resistance to oxidation
- AuSn is compatible with precious metals
- AuSn is RoHS compliant
Gold-Tin Solder Paste
80Au/Sn Powder
- Type 3 (25-45 microns)
- Type 4 (15-38 microns)
- Type 5 (15-25 microns)
- Type 6 (10-20 microns)
- Type 6-SG
- Type 7-SG
No-Clean Flux
- NC-SMQ51SC (used in high-power LED and MEMS)
- RMA-SMQ51A (for difficult to solder surfaces in die-attach)
- NC-SMQ75 (halogen-free and low-residue; requires <10ppm oxygen)
Water-wash Flux
- Indium3.2HF
- Indium3.2
Low-Volume Packaging
- Jars (10g per jar)
- Syringes (5cc syringes)
Related Blog Articles
Indalloy®182
Indalloy®182 (80Au/20Sn) has a melting point of 280°C (556°F). It can be made into solder paste form with various options to address specific applications. Gold-tin solder paste is generally used in applications that require a high melting temperature (over 150°C), good thermal fatigue properties, and high-temperature strength. It is also used in applications that require a high tensile strength and high corrosive resistance, or in step soldering applications where the paste will not melt during a subsequent low-temperature reflow process. For these reasons, Indalloy®182 solder paste is widely used in military, aerospace, high-power LED, and medical applications