High-Performance Precision Gold Preforms

Gold Paste

Gold-tin solder paste is used in a variety of applications that require a high-melting temperature (over 150°C), good thermal fatigue properties, and high-temperature strength. It is widely used in military, aerospace, high-power LED, and medical applications.

Features & Benefits

  • Highest tensile strength of any solder
  • High melting point is compatible with subsequent reflow processes
  • Pb-free
  • Superior thermal conductivity
  • Resistance to corrosion
  • Superior thermal fatigue resistance
  • Good joint strength
  • Excellent wetting properties
  • Resistance to oxidation
  • AuSn is compatible with precious metals
  • AuSn is RoHS compliant
Gold Tin Solder Paste

Gold-Tin Solder Paste

AuSn Alloys:
  • 80Au20Sn
  • 79Au21Sn
  • 78Au22Sn
  • 77Au23Sn
Powder Sizes:
  • Type 2 (-200/+325)
  • Type 3 (-325/+500)
  • Type 4 (-400/+635)
  • Type 5 (-500/+635)
  • Type 6 (-635)
  • Type 6 SGS (5–15μm w/less than 10% overs/unders)
  • Type 7 SGS (2–11μm w/less than 10% overs/unders)
No-Clean Flux:
  • AuLTRA 5.1 (NC-SMQ51SC (used in high-power LED and MEMS applications)
  • Indium10.8HF (accommodates higher processing temperatures required by the electronics industry)
  • RMA-SMQ51A (for difficult to solder surfaces in die-attach)
  • NC-SMQ75 (halogen-free and low-residue; requires <10ppm oxygen)
Water-Wash Flux:
  • AuLTRA 3.2 (Indium3.2 – used in high-power LED applications)
  • Indium3.2HF
Low-Volume Packaging:
  • Jars (10g per jar)
  • Syringes (5cc syringes)
Gold Tin Solder Paste

Gold-Tin (AuSn) Solder Paste

Gold-Tin (AuSn) Solder Paste is generally used in applications that require a high-melting temperature (80Au20Sn has a melting point of 280°C / 556°F). It can be made into a variety of solder paste forms with various options to address specific applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. In step soldering applications,Gold-tin (AuSn) Solder Paste will not melt during a subsequent low-temperature reflow process.