The SPIE Photonics West trade show in San Francisco, CA (January 22-27) is only a few days away! The show focuses on emerging technologies in advanced light-based technologies. For Indium Corporation, this is one of our biggest shows in Northern California, and we look forward to networking with our customers and learning about new applications within this exciting market..
Indium Corporation will be promoting the following products:
- AuLTRA™75, a low-gold solder solution to achieve low voiding and strong solder joints when using applications that require the use of a thickly-plated gold die
- AuLTRA™ ThInFORMS™, premium 80Au/20Sn preforms <0.0005” thick for die-attach applications that improve thermal transfer and overall operational efficiency, as well as reduce voiding, solder volume, and wicking up the die, and
- AuLTRA™ Fine Ribbon, 80Au/20Sn continuous length ribbon with 0.010" width and 0.0006" thick capabilities, ideal for use in automatic die-bonding machines
Stop by booth #3179 to see us, and while you're at it, ask us about our Quick Turn Program for new Au-based preform designs for prototypes. Let us know how we can help you with your future projects!