International Microwave Symposium 2019
Why is Indium Corporation excited to be exhibiting at the International Microwave Symposium in Boston, MA?...
Die Attach
InForms® for Improved Power Device Reliability
Exploring the many benefits of InForm® soldering technology....
Avoid The Void™ - Identifying Causes of Die-Attach Soldering Voids
“How do I reduce my die-attach voids?” There is no sliver bullet, but here is a process to help you identify and reduce your voiding....
2018 International Microwave Symposium
Comes see us at the International Microwave show on June 12-14. We’ll be highlighting our high-temperature product along with many other pr...
Solder Redefined Part 2 – Die-Attach
As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use sold...
Gold-Tin Eutectic Solder
Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) is used in a variety of applications requiring a high reliability, high...
Solder Redefined : The InFORM® for IGBT Assembly
Soldering IGBTs: Focus on the direct-bond copper substrate level of the stack-up....
SiP Materials (System-in-Package) VIDEO
There exists a wide range of assembly products for the SiP process, especially solder pastes....
High Temperature Product offering for Laser and Optical package manufacturing
With Indium’s experience working with laser manufacturers, we know each manufacturer’s product is unique to the end use, so we have a numb...
High Temperature, Pb-free Die-Attach Material Project Webinars - iNEMI
On April 14th, iNEMI will host two webinars for the purpose of discussing a new project geared toward High Temperature, Pb-free Die Attach Materials....
Materials Lifetimes - A Modest Proposal
Specific and consistent terminologies are required to enable accurate and effective discussions of soldering materials....