SPIE Photonics West 2024
Indium Corporation® featured our Precision Au-Based Die-Attach Preforms at SPIE Photonics West 2024, the world’s premier event for...
Die Attach
Sinter material for power electronics - copper's time to shine?
In recent years, silver sinter materials have grown in popularity in power module assembly, especially for die attach......
SPIE Photonics West 2023!
Indium Corporation to promote new specialty product offerings: AuLTRA™75, AuLTRA™ ThInFORMS™, and AuLTRA™ Fine Ribbo...
Which Off-Eutectic AuSn Alloy Do I Use?
Plating dies and/or substrates with pure gold works well to prevent the components from oxidizing, but can lead to undesirable gold-rich solder joints...
A Discussion with 3D InCites on e-Mobility Challenges
Just last month at the IMAPS show in Boston, Sze Pei Lim and I had the opportunity to chat with Francoise von Trapp from 3D InCites to discuss materia...
IMS 2022!
The International Microwave Symposium (IMS) (June 21-23) is the premier annual international meeting for technologists involved in all aspec...
SPIE Photonics West 2022
Indium Corporation to promote new specialty prodict offerings: AuLTRA™75, AuLTRA™ ThInFORMS™, and AuLTRA™ Fine Ribbo...
2021 Space Tech Expo
Come see Indium Corporation's new AuLTRA™75, AuLTRA™ ThInFORMS™, and Thermal Interface Materials at the Space Tech Expo in...
What the Off-Eutectic?
Indium Corporation's new off-eutectic alloy preforms ensure strong solder joints in a plethora of device and package hardware. Our off-eutectic Au...
IMS 2020 Virtual Show
The International Microwave Symposium (IMS) Live Stream Event (Aug 4-6) is the premier annual international meeting for technologists involv...
That's a 'Fine' Ribbon You Got There!
Indium Corporation has developed 80Au20Sn < 0.1” wide fine-grade precision ribbon for high volume, fully automated laser diode assembly proce...
Why Do We Need to Go Thinner?
Indium Corporation has developed a thinner gold preform for high-output lasers, therefore improving the thermal transfer and operational efficiency of...