Die-Attach

Indium Corporation® had the privilege of exhibiting at the world’s premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics, SPIE Photonics

Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

In recent years, silver sinter materials have grown in popularity in power module assembly, especially for die attach. When compared to traditional solders, silver sinter offers numerous benefits

When working with dies and/or substrates that are thickly plated with pure gold, the best way to prevent gold-rich solder jointsis to use an off-eutectic AuSn alloy in the solder

As a Manufacturing Process and Quality Engineer for over thirty years, I have seen a great deal of change with fantastic leaps in raw component, assembly, and metrology

In history, “The Gold Standard” was a monetary system in which countries fixed their currencies to a specified amount of gold. Here at Indium, we also use the phrase, however, to

Hi All, I recently spoke about Mini-LEDs and how Indium Corporation is meeting the assembly needs of that product in a recent post. Something that I had to do a fair bit of research on as a young

Hi All, My team came across an interesting article the other day from IEEE Spectrum that talked about the recent advent of