2018 International Microwave Symposium
Comes see us at the International Microwave show on June 12-14. We’ll be highlighting our high-temperature product along with many other pr...
Die Attach
Solder Redefined Part 2 – Die-Attach
As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use sold...
Gold-Tin Eutectic Solder
Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) is used in a variety of applications requiring a high reliability, high...
Solder Redefined : The InFORM® for IGBT Assembly
Soldering IGBTs: Focus on the direct-bond copper substrate level of the stack-up....
SiP Materials (System-in-Package) VIDEO
There exists a wide range of assembly products for the SiP process, especially solder pastes....
High Temperature, Pb-free Die-Attach Material Project Webinars - iNEMI
On April 14th, iNEMI will host two webinars for the purpose of discussing a new project geared toward High Temperature, Pb-free Die Attach Materials....
Materials Lifetimes - A Modest Proposal
Specific and consistent terminologies are required to enable accurate and effective discussions of soldering materials....
Die-Attach Soldering Using Indium Alloys
There are at least three significant reasons to use indium solder alloys in your die-attach operation: Physical performance, Supplier reliability, Mat...
ELV 2014: High-Lead (Pb) in Automotive Electronics is Good until at Least 2023
Those of you who have been watching this blog for a while - waiting for updates on the European ELV (End of Life Vehicle) legislation - wait no m...
SMTAI 2014 - Technical Conference Participation
SMTA International (SMTAI) will be held in Rosemont, Illinois, September 30 through October 1, 2014. I am very excited about the show as I am e...
RDSON and Solder Volume Resistivity
Interesting question from a Chinese die-attach customer this week asking about volume resistivity of solder. My friend, Eric Bastow, suggested that In...