Why Do We Need to Go Thinner?
Indium Corporation has developed a thinner gold preform for high-output lasers, therefore improving the thermal transfer and operational efficiency of...
Die Attach
Why QuickSinter®? Let’s see the difference between Soldering and Sintering
Dr. McDonough discusses some of the benefits of QuickSinter® including its ability to handle high-temperature operating life without breaking...
2020 SPIE Photonics West Show
Come see Indium Corporation's new AuLTRA™ ThInFORMS™ at SPIE West in San Francisco, CA Feb. 4-6, 2020. AuLTRA™ ThInFORMS&tr...
The Benefits of Indium Corporation Gold/Tin Solder Paste
Indium Corporation’s gold/tin solder paste gives manufacturers the versatility to produce high volumes of scaled-up product on demand without co...
Come See Me at High-Temp Electronics Network Show in Oxford, UK
We’re featuring our Au solder product line and braze materials at the High-Temperature Electronics Network (HiTEN 2019) at St. Anne’s Coll...
International Microwave Symposium 2019
Why is Indium Corporation excited to be exhibiting at the International Microwave Symposium in Boston, MA?...
InForms® for Improved Power Device Reliability
Exploring the many benefits of InForm® soldering technology....
Avoid The Void™ - Identifying Causes of Die-Attach Soldering Voids
“How do I reduce my die-attach voids?” There is no sliver bullet, but here is a process to help you identify and reduce your voiding....
2018 International Microwave Symposium
Comes see us at the International Microwave show on June 12-14. We’ll be highlighting our high-temperature product along with many other pr...
Solder Redefined Part 2 – Die-Attach
As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use sold...
Gold-Tin Eutectic Solder
Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) is used in a variety of applications requiring a high reliability, high...
Solder Redefined : The InFORM® for IGBT Assembly
Soldering IGBTs: Focus on the direct-bond copper substrate level of the stack-up....