SMTAi Exhibitors Collaborate to Showcase Products
Live@SMTAi is a new event at SMTAi that provides an opportunity for industry partners to collaborate to showcase materials so customer can see both eq...
Solder
Assured Solder Recycling Program
Not sure what to do with your solder dross or contaminated solder? Let Indium Corporation make it easy for you with our Assured Recycling Program....
Using a Math PreTest Before Giving a Lean Six Sigma Workshop
Patty tells Rob and The Professor how important it is to use a math pretest to determine the skill level of her class before launching into her traini...
Solder Preforms - Now More Than Ever
Solder preforms come in a variety of shapes, sizes and materials and can be the perfect solution to your unique application....
SMTA Pan Pacific: Electronics for Harsh Environments - "The Next Big Thing in Electronics"
Automotive harsh environments may be the next “big thing” in electronics....
Join Me at SMTA Pan Pacific February 5-8
Folks, I am giving a paper, chairing a session and hosting a panel at SMTA Pan Pacific on Februrary 6, 2018 at the Hapuna Beach Prince Resort in Hawai...
Tech Seconds with Phil Zarrow: Setting Up a Blind Solder Materials Comparison Study
In this installment of Tech Seconds, Phil outlines the steps for conducting an effective blind solder materials comparison. ...
Solder Redefined Part 4 – Baseplate to Heat-Sink
At Indium Corporation, we're redefining how we use solder at the die-attach, DBC to baseplate, and baseplate to heat-sink levels so we can achieve...
Solder Redefined Part 3 – DBC Substrate to Baseplate
As we've discussed, there are three attach levels of peak concern in the IGBT stack up. At Indium Corporation, we're redefining how we use sol...
Solder Redefined Part 2 – Die-Attach
As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use sold...
Solder Redefined Part 1 – Introduction
In this series, Seth explores considerations for redefining solder at three attach levels of peak concern in the IGBT stackup: the die level, the subs...
Interview with Sze Pei Lim at Productronica China 2017
Interview with Sze Pei Lim at Productronica China 2017. ...