Why Do We Need to Go Thinner?
Indium Corporation has developed a thinner gold preform for high-output lasers, therefore improving the thermal transfer and operational efficiency of...
AuSn
2020 SPIE Photonics West Show
Come see Indium Corporation's new AuLTRA™ ThInFORMS™ at SPIE West in San Francisco, CA Feb. 4-6, 2020. AuLTRA™ ThInFORMS&tr...
How does AuSn alloy and flux impact the reliability of solder paste?
When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-e...
Why is AuSn powder size important for solder paste application?
Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. Thi...
The Benefits of Indium Corporation Gold/Tin Solder Paste
Indium Corporation’s gold/tin solder paste gives manufacturers the versatility to produce high volumes of scaled-up product on demand without co...
Come See Me at High-Temp Electronics Network Show in Oxford, UK
We’re featuring our Au solder product line and braze materials at the High-Temperature Electronics Network (HiTEN 2019) at St. Anne’s Coll...
International Microwave Symposium 2019
Why is Indium Corporation excited to be exhibiting at the International Microwave Symposium in Boston, MA?...
The Impact of Bonding Surface Plating on the Reliability of a AuSn (Gold-Tin) Solder Joint
Performing die-attach using AuSn solder alloy preforms against gold plating? You may need an off-eutectic solder alloy to compensate for the Au that i...
2018 International Microwave Symposium
Comes see us at the International Microwave show on June 12-14. We’ll be highlighting our high-temperature product along with many other pr...
Cooling and Performance Optimized by 80Au20Sn Solder Bond
80Au20Sn solder preforms transfer heat from the active layer in laser diodes, creating a strong bond for long-term reliability. ...
Soldering 80Au/20Sn with Specialized Fluxes & Formic Acid
Not all fluxes can handle the high processing temperature required for Au/Sn solder preforms....
Fluxless Soldering of 80Au/20Sn with Forming Gas/Inert Atmosphere
Soldering without flux is generally regarded as difficult if not impossible. Yet a fluxless process is routinely done with 80Au/Sn ribbon and preforms...