Indium Corporation has developed a thinner gold preform for high-output lasers, therefore improving the thermal transfer and operational efficiency of...

Posted On: January 28th, 2020 | By: Jenny Gallery

2020 SPIE Photonics West Show

Come see Indium Corporation's new AuLTRA™ ThInFORMS™ at SPIE West in San Francisco, CA Feb. 4-6, 2020. AuLTRA™ ThInFORMS&tr...

Posted On: October 18th, 2019 | By: Bernard Leavitt

How does AuSn alloy and flux impact the reliability of solder paste?

When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-e...

Posted On: October 18th, 2019 | By: Bernard Leavitt

Why is AuSn powder size important for solder paste application?

Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. Thi...

Posted On: July 19th, 2019 | By: Bernard Leavitt

The Benefits of Indium Corporation Gold/Tin Solder Paste

Indium Corporation’s gold/tin solder paste gives manufacturers the versatility to produce high volumes of scaled-up product on demand without co...

Posted On: June 21st, 2019 | By: Bernard Leavitt

Come See Me at High-Temp Electronics Network Show in Oxford, UK

We’re featuring our Au solder product line and braze materials at the High-Temperature Electronics Network (HiTEN 2019) at St. Anne’s Coll...

Posted On: May 30th, 2019 | By: Bernard Leavitt

International Microwave Symposium 2019

Why is Indium Corporation excited to be exhibiting at the International Microwave Symposium in Boston, MA?...

Posted On: November 8th, 2018 | By: Bernard Leavitt

The Impact of Bonding Surface Plating on the Reliability of a AuSn (Gold-Tin) Solder Joint

Performing die-attach using AuSn solder alloy preforms against gold plating? You may need an off-eutectic solder alloy to compensate for the Au that i...