IMS 2022!
The International Microwave Symposium (IMS) (June 21-23) is the premier annual international meeting for technologists involved in all aspec...
The International Microwave Symposium (IMS) (June 21-23) is the premier annual international meeting for technologists involved in all aspec...
AuLTRA™ 3.2 and AuLTRA™ 5.1 are air or nitrogen reflow AuSn solder pastes specially formulated for higher processing temperatures and asse...
Indium Corporation to promote new specialty prodict offerings: AuLTRA™75, AuLTRA™ ThInFORMS™, and AuLTRA™ Fine Ribbo...
Come see Indium Corporation's new AuLTRA™75, AuLTRA™ ThInFORMS™, and Thermal Interface Materials at the Space Tech Expo in...
While continuing to be a premier solder materials manufacturer and supplier, Indium Corporation now manufactures and supplies jewelry making materials...
Indium Corporation's new off-eutectic alloy preforms ensure strong solder joints in a plethora of device and package hardware. Our off-eutectic Au...
The International Microwave Symposium (IMS) Live Stream Event (Aug 4-6) is the premier annual international meeting for technologists involv...
Indium Corporation has developed 80Au20Sn < 0.1” wide fine-grade precision ribbon for high volume, fully automated laser diode assembly proce...
Indium Corporation has developed a thinner gold preform for high-output lasers, therefore improving the thermal transfer and operational efficiency of...
Come see Indium Corporation's new AuLTRA™ ThInFORMS™ at SPIE West in San Francisco, CA Feb. 4-6, 2020. AuLTRA™ ThInFORMS&tr...
When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-e...