SPIE Photonics West 2022
Indium Corporation to promote new specialty prodict offerings: AuLTRA™75, AuLTRA™ ThInFORMS™, and AuLTRA™ Fine Ribbo...
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Join Me at SMTA's PanPac 2022 - January 31 to February 3
Folks, I will be presenting three papers at PanPac 2022. They are: 1. Low Melt High Remelt Solder Paste, co-authored with Claire Hotvedt of Indium Cor...
Using FMEA to Determine Your Tin Whisker Mitigration Strategy
Folks, In our last post, we discussed techniques to mitigate tin whiskers. To help determine what your tin whisker mitigation strategy should be, cons...
Tin Whiskers IV: Mitigation
Folks, In the last post on tin whiskers, we discussed detection. In this post, we will cover mitigation. Since compressive stresses are a primary caus...
Tin Whiskers 101: Part III: Detection
Folks, One of the great challenges of tin whiskers is detecting them. When one considers that their median thickness is in the 3 to 5 micron range (a...
Back to Basics: Au-Based Alloys
Indium's “Gold Standard” refers to the overall reliability and quality you can expect from our gold-based solder materials. Gold-based...
SMTAI: A Big Success
Folks, I just can back from SMTAI in Minneapolis a few weeks ago. To me it was a big success. One of the reasons being that attendance was higher than...
Tin Whiskers 101: Part 2: What Causes Them
Folks, Continuing our series on tin whiskers. In the last post we discussed what they are. in this post we will discuss what causes them. Tin whiske...
Winners Announced for SMT IQ Test
Folks, A few weeks ago, I posted an SMT quiz on my blog as an opportunity for my readers to test their SMT IQ. We recei...
Miniaturization in LED Technology: MicroLEDs
LEDs are getting smaller, how do Indium Corporation's materials meet the manufacturing challenges of these products? Here we'll take a look at...
Miniaturization in LED Technology: MiniLEDs
LEDs are getting smaller, how do Indium Corporation's materials meet the assembly challenges of these products. First, we'll take a look at Mi...
SiP Printing 101 Webinar Follow-Up
Recently, I hosted a webinar for Stencil Printing for System in Package Applications. I wanted to take some time to offer a better explanation on impo...