Durafuse™ LT - Drop-shock
Low temperature Durafuse™ LT's drop-shock test is two orders of magnitude better than the drop shock test of a BiSnAg alloy....
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Not all fluxes and solder pastes are created equal!
The different flux and solder paste formulations mean that some products will have different material lifetimes than others. Understanding the lifetim...
More on SMTA Pan Pacific 2020
I will be presenting this coming February at SMTA PanPac. Here are several reasons why you should come to this show....
Indium Preform Order Quantity
Since pure indium preforms are so soft, making thousands of parts requires different processing and packaging methods than manufacturing jus...
Indalloy® 292 - High Reliability Alloy
Indium Corporation's new high reliability solder alloy Indalloy® 292 is focused on exceeding the thermal cycling requirements for automotive a...
Durafuse™ LT - New Mixed Solder Technology!
New Durafuse™ LT is a novel mixed alloy system designed to combine low temperature reflow with drop-shock performance similar to or better ...
Semiconductor Fluxes: Part 3
Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpa...
How does AuSn alloy and flux impact the reliability of solder paste?
When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-e...
Why is AuSn powder size important for solder paste application?
Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. Thi...
Semiconductor Fluxes: Part 2
This is the second in a series of posts about semiconductor fluxes, and talks about the optimal dipping depth for flip-chip fluxes....
Semiconductor Fluxes: Part 1
If you are a little intimidated by semiconductor products, this blog post provides a simple explanation to help you better understand these products....