Minimizing Graping
Folks, This post is an excerpt on graping, from Indium Corporation's The Printed Circuits Assemblers Guide to Solder Defects. Intr...
Folks, This post is an excerpt on graping, from Indium Corporation's The Printed Circuits Assemblers Guide to Solder Defects. Intr...
Folks, Two of the workers at Ivy-Benson electronics just got engaged and they are on their way to a factory in Mexico to see if their boss Maggie Bens...
Folks, I am presenting a workshop on Defeating Defects at SMTAI on October 31. This workshop is based on the recently published booklet The Printed Ci...
Soldering and welding are often used interchangeably in metal fabrication, but each technique is different and has a distinct application. While both ...
Folks, Soldering is one of the oldest technologies developed by humankind, perhaps as long as 6,000 years ago. Early uses were in the making of jewelr...
Folks, In my last post, I shared about an Excel®-based software tool called Line Balancer™ to help candidates for SMTA Certification prepare...
Folks, some years ago I created a software tool, StencilCoach™, to calculate the stencil parameters to provide for an adequate amount of so...
Folks, Over ten years ago, I created the characters Patty and The Professor. The intent was to tell SMT assembly process improvement stories through t...
Folks, In the last post on tin whiskers, we discussed detection. In this post, we will cover mitigation. Since compressive stresses are a primary caus...
Folks, Continuing our series on tin whiskers. In the last post we discussed what they are. in this post we will discuss what causes them. Tin whiske...
Folks, Matching a reflow profile to a solder paste spec is a required skill for an SMT process engineer. In light of this, let’s do an exam...
Folks, SMT assembly is an optimization process. There is no single stencil printing process for all PWB designs. The stencil printing parameters of st...