Indium Blog

SPIE Photonics West 2023!

  • AuSn
  • Die Attach
  • Gold Solder
  • Package Attach

  • The SPIE Photonics West trade show in San Francisco, CA (January 28 - February 2) is less than two weeks away! SPIE is the international society for optics and photonics, focusing on emerging technologies in advanced light-based technologies. For Indium Corporation, this is one of our biggest shows, and we look forward to networking with our customers and learning about new applications within this exciting market.

    Indium Corporation will be promoting the following products:

    • Precision Die-Attach (PDA) Preforms: ultra-precise solder preforms that ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product. Our PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications.
    • AuLTRA™ ThInFORMS™premium 80Au/20Sn preforms <0.0005” thick for die-attach applications that improve thermal transfer and overall operational efficiency, as well as reduce voiding, solder volume, and wicking up the die.
    • AuLTRA™75: a low-gold solder solution to achieve low voiding and strong solder joints when using applications that require the use of a thickly plated gold die.
    • AuLTRA™ Fine Ribbon: 80Au/20Sn continuous length ribbon with 0.010" width and 0.0006" thick capabilities, ideal for use in automatic die-bonding machines.

    Stop by booth #3085 to see us and while you're at it, ask us about our Quick Turn Program for new Au-based preform designs for prototypes. Let us know how we can help you with your future projects!