Indium Corporation® had the privilege of exhibiting at the world’s premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics, SPIE Photonics West, Jan. 30-Feb. 1, in San Francisco. It was such a great experience and exciting to learn about all the new applications in this innovative market, and to network with our colleagues, and customers.
来自 70 多个国家的 24,000 多名专业技术人员在旧金山莫斯克尼中心注册。SPIE 主办了 1 500 多家参展商，并在为期一周的时间里举办了 5 000 多场技术演讲，其中包括 BiOS、LASE、OPTO、Quantum West、BiOS Expo、Photonics West 展览会、Quantum West 展览会以及同期举办的 AR|VR|MR 会议和展览。
As a leading solder supplier for laser and optical applications, Indium Corporation® promoted the following high-performance gold-based alloy solutions:
Precision Die-Attach (PDA) Preforms:Ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end-product. Indium Corporation's Au-based PDA preforms offer the NEW Gold Standard – the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
- 高度精确的厚度控制
- 精确的边缘质量
- 优化清洁度
- 默认华夫饼包装方法
- 可用于金基合金
AuLTRA® ThInFORMS®：优质 80Au/20Sn 超薄预型件，厚度仅为 0.00035 英寸（0.00889 毫米或 8.89 微米），可提高高输出激光器的整体运行效率。AuLTRA®ThInFORMS® 可帮助解决以下常见问题：
- 短路时减少的焊料量可抑制焊料向裸片上淌，从而最大限度地降低短路风险。
- 热传导性能差--0.00035 英寸的超薄预型件减少了键线厚度（BLT），从而改善了热传导性能，提高了设备的寿命和性能。
AuLTRA®75：一种非共晶 AuSn 预型件解决方案（75Au/25Sn），设计用于在使用镀金层较厚的裸片的应用中提高金属间可靠性，例如用于 5G 及其他关键军事和航空航天无线通信领域高频、大功率射频功率放大器器件的 GaN 裸片。AuLTRA®产品系列还有 78Au/22Sn 和 79Au/21Sn 两种成分。
AuLTRA®Fine 色带：80Au/20Sn 连续长度色带，宽度为 0.010 英寸，厚度为 0.0006 英寸，非常适合用于自动模头粘合机。
Indium Corporation's gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most used gold-based alloy is 80Au/20Sn; it is the pillar alloy of the microelectronics industry with a melting point of 280°C and works exceptionally well in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporation's AuSn solder offers numerous benefits including:
- 在所有焊料中拉伸强度最高
- 高熔点与后续回流焊工艺兼容
- 卓越的导热性
- 抗腐蚀
To learn more about Indium Corporation's precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms.
感谢各位莅临我们的展台，我们期待着在2025 年的 SPIE Photonics West 展会上与大家见面！
