半导体封装和装配

As semiconductor packaging technologies evolve to meet industry demands of smaller, faster, higher power, more reliable, more efficient devices, packaging and assembly materials play a crucial role. From industry leading die attach solder pastes, ultra-fine solder pastes for SiP, to innovative flux technology for flip-chip bonding and BGA ball attach. Indium Corporation’s semiconductor packaging and assembly materials address todays challenges and help power the future.

获取支持

概述

Semiconductor packaging and assembly are critical to manufacturing semiconductor devices, ensuring functionality, efficiency, and reliability. This back-end-of-line (BEOL) process involves encapsulating the silicon die or integrated circuit (IC) to ensure reliable electrical connections to the PCB and other systems. It’s essential for maintaining functionality and durability in diverse environments. Indium Corporation’s expertise in these processes and product selection meets the unique needs of the industry.

益处

经过验证的材料

Indium Corporation’s advanced products have been integral in the advancement of semiconductor assembly. Our wafer bumping flux WS-3401 and flip-chip flux WS-641 are widely used in 2.5D and advanced semiconductor assembly.

引领潮流

Over a decade ago, Indium Corporation introduced the first ultra-low residue flux and has remained a pioneer in the field, offering a diverse range of ultra-low residue fluxes.

^SiPaste®3.2HF

十多年来，真正的可清洗 SiPaste®3.2HF 一直是数百万 SiP 模块的首选。

无通量

通过与行业领导者合作，我们为先进的倒装芯片连接开发出了一种无助熔剂粘合剂解决方案。

20 年

经过 20 多年性能验证，我们的 SMQ75 高温高铅膏仍然是引线框架上芯片连接应用的行业标准。

高温无铅

我们非常自豪地推出 Durafuse® HT，这是一种无铅焊料解决方案，可在高温应用中替代含铅焊料。

50 亿美元

To date, over 5 billion front-end SiP modules have been manufactured using Indium Corporation’s semiconductor materials, with continuous growth expected.

可持续性

这些助焊剂实现了真正的免清洗工艺，通过降低与清洗化学品、水和能源消耗相关的成本，推动了可持续发展。

半导体封装和装配的基本考虑因素

半导体组装涉及将半导体芯片或集成电路封装并互连到基板上以制造功能电子设备的过程。半导体封装 涉及以下关键考虑因素：

互联可靠性

确保稳固的电气连接，最大限度地减少信号损失和电阻。

热管理

采用高效的散热解决方案，防止过热并保持设备性能。

材料兼容性

选择热膨胀系数 (CTE) 相容的封装材料，以减少互连器件上的应力，防止热循环导致的机械故障。

半导体封装与组装产品

Indium Corporation offers a full line of wave fluxes that can meet the needs of numerous selective soldering applications. For example, the WF-9948 flux is excellent for those applications where reliability and minimal post-soldering residues are required.