高性能计算
High-performance computing (HPC) is a driving force behind innovation and efficiency in electronics assembly and semiconductor packaging, and it requires advanced materials to do so. It fuels the rapid development of electronic products and systems around the world. Plus, it is essential for developing cutting-edge technologies like artificial intelligence (AI), and machine learning, which rely on sophisticated semiconductor designs and packaging solutions.
概述
Partner with Indium Corporation for High-Performance Computing Success
From solder pastes and semiconductor fluxes to thermal interface materials, the precise selection, combination, and application of these components are crucial for high production yields and exceptional product quality. Indium Corporation excels in this area, providing technical expertise and service to help customers effectively implement the optimal combinations of materials.
主板
- 无粘性残留物，信息和通信技术性能卓越
- 卓越的 HIP 和 NWO 性能
- 卓越的保形涂料兼容性
- 比含硼低温材料好两个数量级以上
- TCT 性能可能优于 SAC305
- 增加焊接量，提高机械可靠性
- WF-7745 不含 VOC 的助焊剂
- WF-9945 Rosin-containing flux
内存模块
- 受限助焊剂残留物
- 出色的传输效率
- 提高抗跌落冲击能力
- 提高 TCT 的绩效
图形卡
- 当 BGA 发生翘曲时，消除 HIP 和 NWO
- 在不同表面上都有出色的润湿性
电源设备
- 减少地垫空隙
- 减少助焊剂残留，提高 SIR 性能
连接器
- 增加焊接量，提高机械可靠性
Heat-Sink
- 压缩在两个表面之间，无需回流
- 高导热性
- 优异的热循环性能
相关产品
我们提供全面的产品选择，包括半导体助焊剂、焊膏和高可靠性合金，旨在帮助客户实现其独特的目标。
Why Indium Corporation
最大化您的收益和潜力--今天就与我们合作
As a global leader known for our technical expertise and innovative solutions, we ensure that your products exceed industry standards, offering unmatched performance and reliability. Partner with us to experience cutting-edge technology and exceptional service—the Indium Corporation difference.
您的成功
是我们的目标
利用最新材料、技术和专业应用支持优化您的流程。一切从与我们的团队联系开始。