应用
系统级封装（SiP）和异构集成组件（HIA）
Advanced semiconductor technology, including system-in-package (SiP) and heterogeneous integration, involves combining various semiconductor devices into a single package to improve functionality, performance, and reduce form factor—while remaining cost-effective. SiP, a form of heterogeneous integration, enables the development of complex systems for high-performance devices. At Indium Corporation, our deep understanding of technology and processes allows us to create high-quality soldering products, including SiP solder paste, semiconductor fluxes, and high-performance thermal interface materials. These innovations ensure reliable electrical, mechanical, and thermal connections within integrated systems.
概述
解决当前和未来 HIA 挑战的成熟解决方案
微型化和对增强功能的需求使 HIA 和 SIP 更加流行，从而推动了这些技术的进一步发展。这些日益增长的需求给 OSAT 的封装设计带来了挑战，需要高性能的热管理材料和设计来实现更高效的散热，同时由于支座的缩小，还需要真正的免清洗助焊剂和精细粉末焊膏。
益处
针对 SIP 和 HIA 组装难题的焊接解决方案
经过验证的性能
我们的产品在半导体组装的发展过程中发挥了不可或缺的作用。具体而言，晶圆凸块助焊剂 WS-3401 和倒装芯片助焊剂 WS-641 用于 2.5D 应用的大批量生产。
第一次免清洗
Indium Corporation introduced the first ultra-low residue flux over a decade ago and has remained a pioneer, offering a diverse range of these advanced fluxes.
首选 SiPastes
5 年多来，SiPaste® 3.2HF 已成为数百万制造商模块的首选，迄今已用于 50 多亿个前端 SiP 模块。
可持续性
Indium Corporation’s advanced fluxes enable a true no-cleaning process, supporting sustainability by cutting costs tied to cleaning chemicals, water, and energy usage.
广泛的热能解决方案
Indium Corporation offer a wide variety of thermal solutions, from solder TIMs to liquid metals and liquid metal paste. These offerings cover a wide range of thermal conductivity, choices of TIMs for different applications are available.
完整作品集
从使用去离子水的易清洁水洗解决方案到真正的免清洗选项，从焊接解决方案到热界面材料，我们提供全面的解决方案，帮助客户解决问题并推动新的设计和开发。
热管理（TIM）
成套系统
3D 逻辑/存储器和倒装芯片
球形网格阵列
SMT
SiP 和 HIA 产品
Indium Corporation offers a full material suite for heterogeneous integration assembly that meets the stringent requirements of advanced packaging technology, from fine powder paste, flip-chip flux, ball attached flux, to various options of thermal interface materials.
相关应用
MEMs 组件
Micro-Electro-Mechanical Systems (MEMS).
半导体封装和装配
关键的半导体封装确保了功能性和耐久性。
系统级封装（SiP）与异构集成组装（HIA）
系统级封装（SiP）和异构集成解决方案
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