半导体焊膏
Fine Powder Solder Pastes
Indium Corporation’s fine powder solder pastes are expertly designed to address the growing demands of miniaturization in the electronics industry. Suitable for a variety of applications, including printing, contact dispensing, and jetting, these pastes are specifically formulated to cater to unique customer requirements. Special attention during flux and powder production ensures that the final product is optimized to effectively tackle manufacturing challenges and increase yields.
技术支持：铟泰公司
- 高质量粉末，高产量
- Excellent Wetting on Various Substrates
- Covers Printing, Jetting, and Dispensing
产品概览
卓越的粉末可制造性
Indium Corporation’s fine solder powders (Type 6, Type 7, and Type 8) are produced with a particle size distribution that meets IPC standards, ensuring minimal fines and excess particles. Special care during the manufacturing process optimizes the powder’s smoothness and sphericity, resulting in high production yields and minimal defects—particularly on thin substrates that are prone to warpage.
出色的通量能力
The flux used in our fine-powder solder pastes undergo additional proprietary manufacturing steps to ensure high production yields in advanced packaging. This includes the elimination of fine flux impurities that could disrupt the printing process, as well as the inclusion of robust oxidation barriers to prevent further oxidation of the solder powder.
概况
Fine Powder Solder Pastes Products
- 通过印刷或喷射应用
- Reflow in inert atmosphere (typically <100 ppm 02 level)
- Compatible with SnAgCu, SnAg, SnSb, or other common Pb-free alloys
- Available in Type 5, Type 6, Type 7, and Type 8 powder size for fine-feature applications
| 助焊剂类型* | Flux Application Method | 说明 | 清洁方法 | Halogen-Free | 材料 |
|---|---|---|---|---|---|
| WS | 印刷 | Best all-around pure water-soluble paste | 温 DI 水 | 是 | SiPaste® 3.2HF |
| C | 印刷 | Good wetting power and HIP mitigation | 去离子水 + 皂化剂或半水化学制剂 | 是 | SiPaste® C201HF |
| 北卡罗来纳州 | 印刷 | Best-in-class transfer efficiency and stencil life Best all-around fine feature paste | 去离子水 + 皂化剂或半水化学制剂 | 是 | SiPaste® C312HF |
| NC-ULR | 印刷 | No-clean, ultra-low residue process that is compatible with post-reflow underfill | No-clean | 是 | SiPaste® SMQ77 |
| WS | 喷射 | For dot jetting of 300 μm diameter and above, and fine-line dispensing for metallid-attach | 温 DI 水 | 是 | PicoShot® WS-5M |
| 北卡罗来纳州 | 喷射 | For dot jetting of 300 μm diameter and above, and fine-line dispensing for metallid-attach | Solvent- or aqueous-based chemistry or no-clean | 是 | PicoShot® NC-5M PicoShot® NC-6M |
| 北卡罗来纳州 | 喷射 | For dot jetting down to 80 μm diameter and above, and fine-line dispensing for metallid-attach | Solvent- or aqueous-based chemistry or no-clean | 是 | 铟12.8HF |
产品数据表
SiPaste®C312HF Solder Paste PDS 100100 R4.pdf
SiPaste® 3.2HF Pb-Free Water-Sol Solder Paste for SiP Designs PDS 99821 R1.pdf
SnPbPicoShot®NC-5M PDS 100016 R5.pdf
SAC305PicoShot®WS-5M PDS 100307 R1.pdf
相关应用
Fine Powder Pastes can be used in a variety of applications.
2.5D 和 3D 包装
Techniques to incorporate multiple dies in a…
系统级封装（SiP） 异构集成 （HIA）
System-in-package (SiP) and heterogeneous integration solutions
相关市场
Indium Corporation’s Fine Powder Pastes are applicable for use in many markets.
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