金焊料

Indium Corporation 是領先的金焊料創新者，其產品適用於高溫、高可靠性的應用，例如醫療、航太、光電、汽車及其他許多產業中的裸片連接與氣密密封。

Gold-based alloys offer strong joints, excellent corrosion and oxidation resistance, and good thermal and electrical transfer at the joint. Our gold solder portfolio includes wire, paste, preforms, and ribbon. They are manufactured with cutting-edge technology to ensure quality as well as push the boundaries of precision.

Powered by Indium Corporation

所有焊錫中最高的拉伸強度
優異的熱傳導性
無鉛、符合 RoHS 標準

金焊料概述

何時選擇黃金產品

Higher yields and cost per unit make gold a viable option for many applications, even though the initial cost is more than alternative solders. A low oxygen atmosphere may be required if the application is flux free. In some instances, pressure is required to promote strong, void-free reflow on horizontal services.

屬性

金焊料以強大的接合強度、優異的耐腐蝕性和抗氧化性，以及可靠的銅焊接點熱傳導和電傳導而著稱。

處理選項

您可以選擇經過驗證的加工方法，包括：真空焊接、接模、回流焊、雷射焊接、氣相回流焊和手動焊接。

特點

我們提供超過 320 種合金解決方案，能夠承受高達 1,100°C 的溫度。創新的無鉛替代品，包括金焊料、燒結、預成型以及與新型助焊劑系統整合的先進合金技術，也是我們持續開發的項目之一。

&GT;280°C

High melting point compatible with subsequent reflow processes.

關鍵應用

Automotive, RF infrastructure, medical, laser, military, and aerospace applications.

無鉛

Lead-free and RoHS compliant.

#可靠性排名第一

Highest tensile strength of any solder.

金基合金

Indium Corporation offers a broad range of gold-based alloy solutions with melting temperatures up to 1,064°C:

合金名稱	組成	熔點
^{Indalloy®182}	80Au20Sn	280°C 共晶
^{Indalloy®200}	100Au	1,064°C Eutectic
^Indalloy®178	82Au18In	固態 451°C / 液態 485°C
^{Indalloy®184}	96.8Au3.2Si	363°C 共晶
^{Indalloy®183}	88Au12Ge	356°C 共晶
^{Indalloy®270}	75Au25Sn	固體溫度 278°C / 液體溫度 332°C
^{Indalloy®269}	78Au22Sn	固體溫度 278°C / 液體溫度 301°C
^{Indalloy®271}	79Au21Sn	固體溫度 278°C / 液體溫度 289°C