Flussi

In un post precedente ho parlato del fenomeno del “Large Ground Plane Voiding” nell’assemblaggio elettronico e ho fatto riferimento a uno strumento statistico chiamato “diagramma di Ishikawa”. Questo strumento aiuta a mappare un processo e fornisce un

The tremendous increase in the use of bottom terminated components (BTCs), some estimates are at more than 50 billion per year, have heightened the concern for minimizing voiding between the thermal

Phil Zarrow: Brook, we've discussed handling solder paste from the refrigerator to the stencil printer, but there's a lot more to this story, particularly from the factory to the customer.

Although Au/Sn solder performs like a braze in service, it can also be processed as a solder using flux. There is a caveat – not all fluxes can handle the high processing temperature required

La saldatura senza fondente è generalmente considerata difficile, se non impossibile. Eppure, il processo senza fondente viene abitualmente eseguito con nastri e preforme in lega 80Au/Sn: com’è possibile? La risposta breve è:

The copper coupon is a pretty simple test. A given amount of solder is reflowed onto a copper coupon with a specified amount of each flux. The test can be performed on either lead-free solder or

The Alchemist (WF-9955) applies her sophisticated understanding of wave soldering flux ingredients and their interactions with metallizations to defeat Oxide, while at the same time effectively

Phil Zarrow: This is part one of a three-part series. This video is for anyone interested in design of experiment aspect of Avoid the

This video is for electronics assembly professionals who are looking to improve their wave soldering processes. It includes tools and resources that will help overcome common challenges. Phil Zarrow: