Thermisches Management
TIM1, TIM1.5 und TIM2
Metal-based thermal interface material (TIM) solutions provide superior thermal performance and long-term reliability across multiple layers of the thermal stack. Whether using air cooling, direct liquid cooling, or immersion cooling, these TIMs can be tailored to meet specific thermal demands. Their ability to wet to a wide range of surfaces, combined with high isotropic thermal conductivity and low yield and flow strengths, allows them to conform to surface irregularities, effectively reducing overall thermal resistance (Rth).
Übersicht
Spezialisiert auf metallbasierte TIMs mit Vorteilen in Bezug auf Temperatur, Zuverlässigkeit und Konformität
Indium Corporation leads the way in developing novel TIMs and processes for TIM1, TIM1.5, and TIM2 applications.
TIM1
Solders and liquid metals are used as high-performance TIMs between a semiconductor die and a package lid. Reflow and non-reflow solutions are available for LGA, PGA and BGA packages that see single or multiple reflow cycles.
TIM1.5
High-performance computing (HPC) applications require best-in-class TIM materials and process expertise. TIM1.5 (bare die lidless BGA packages) is the interface between a bare die and a heat-sink or cold plate and is often used in HPC design. Indium Corporation can help you choose between soldered, compressible, or liquid metal-based TIMs.
TIM2
TIM2 is the interface between a heat spreader or lid and a heat-sink. We typically recommend compressible TIMs, such as Heat-Spring®.
TIM1, TIM1.5, & TIM2 Products
Löt-TIMs
Solder TIM solutions offer superior reliability and…
Komprimierbare TIMs
Compressible TIMs for top thermal performance and…
Flüssigmetall und Flüssigmetallpaste
Liquid metals that are RoHS-compliant and non-toxic.
Phasenwechselmetall-TIMs
Discover the advantages of PCMA TIMs over…
Verwandte Anwendungen
Verpackung und Montage von Halbleitern
Critical semiconductor packaging ensures functionality and durability.
Eintauchkühlung
A technique on the rise for thermal…
SiP and Heterogeneous Integration Assembly (HIA)
System-in-Package (SiP) und heterogene Integrationslösungen
Thermisches Management
Thermal solutions for HPC ensuring reliability and…
Verpackung und Montage von Leistungselektronik
Extensive range of proven high-reliability solder and…
Verwandte Märkte
Ihr Erfolg
ist unser Ziel
Optimieren Sie Ihre Prozesse mit den neuesten Materialien, Technologien und fachkundiger Anwendungsunterstützung. Alles beginnt damit, dass Sie sich mit unserem Team in Verbindung setzen.