焊料合金
Durafuse® HT
Designed as an alternative to high-Pb alloys traditionally used for semiconductor die-attach application, Durafuse® HT is a high temperature, Pb-free solder solution. Following the Durafuse® mixed-alloy design, Durafuse® HT has been designed to maintain high die shear strength at high temperature and be safe from re-melting at PCBA reflow peak temperatures of 260°C. Durafuse® HT is the only Pb-free solder option that meets this requirement.
技术支持：铟泰公司
- 无铅高温溶液
- Utilize Current Equipment and Process
- Electrical and Thermal Properties ≥ High-Pb
产品概览
High Shear Strength
Durafuse® HT maintains shear strength >15MPa, even at temperatures around 280°C, outperforming high-Pb solder.
Replacement to High-Pb Solder
Durafuse® HT 在用于含铅焊膏的传统工艺时不需要特殊设置。这降低了采用新材料的风险，缩短了产品上市时间。
优于铅合金
Though Pb-free, Durafuse® HT outperforms high Pb-containing materials in thermal conductivity, thermal mechanical strength, and electrical conductivity.
可持续发展
By replacing Pb in applications, Durafuse® HT helps customers achieve sustainability goals and comply with environmental regulations and policies.
产品数据表
Durafuse®HT 高温无铅焊膏 PDS 100025 R0.pdf
相关应用
Durafuse® HT solder paste is applicable for a variety of industry applications.
电力电子产品包装与装配
种类齐全、经过验证的高可靠性 和……
夹子和导线架连接
Applications Clip and Lead Frame Attach In…
芯片
芯片解决方案包括用于金（Au）基…的焊膏……
PCB
经过验证且处于行业前沿PCB 组装材料PCB
相关市场
Durafuse® HT is intended for die-attach and clip-attach applications for discrete power devices and SMD multi-chip module power devices, which are widely used in certain markets.
相关产品
高温焊膏
Pb or Pb-free high-temperature solder pastes.
Durafuse®技术
一项*专利产品 合金 ，可实现……
Durafuse®HR
可靠性 空洞率 合金 HR。
烧结材料
Pressure or pressureless silver or copper sinter…
专家支持，结果可靠
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