Features & Benefits
These products are designed for reflow in air or nitrogen atmosphere of 100ppm oxygen or less. Jetting solder pastes are specifically formulated for fine-pitch and ultra-fine dispensing for various applications as well as giving reliable dispensing of a consistent size deposit in automated dispensing or jetting equipment.
All Jetting Pastes use Type 6SG powder size.
Jetting (Microdispense) Solder Paste:
|Paste Name||Description||Alloy||Compatible Printer Solder Paste|
|MD101||No-clean SAC solder paste||SAC305||Indium10.1|
|MD089||No-clean SAC solder paste||SAC305||Indium8.9|
|MD089HF||No-clean SAC solder paste||SAC305||Indium8.9HF|
|MD092H||No-clean SnPb solder paste||Sn63||NC-SMQ92J|
|MD064R||Water-soluble SAC solder paste||SAC305||Indium6.4R|
|MD064R||Water-soluble SnPb solder paste||Sn63||Indium6.4R|