Microdispense

Microdispense

Jetting or microdispense solder pastes include no-clean and water-soluble solder pastes, and are used with SnAgCu and SnPb alloy systems. These pastes are designed for microdispense and jetting applications. Jetting pastes are compatible with their corresponding printable solder pastes, as identified in the table below. It is important that they ONLY be used with the matched printable solder pastes.

Features & Benefits

These products are designed for reflow in air or nitrogen atmosphere of 100ppm oxygen or less. Jetting solder pastes are specifically formulated for fine-pitch and ultra-fine dispensing for various applications as well as giving reliable dispensing of a consistent size deposit in automated dispensing or jetting equipment.

All Jetting Pastes use Type 6SG powder size.

Microdispense

Jetting (Microdispense) Solder Paste:

Paste Name Description Alloy Compatible Printer Solder Paste
MD101 No-clean SAC solder paste SAC305 Indium10.1
MD089 No-clean SAC solder paste SAC305 Indium8.9
MD089HF No-clean SAC solder paste SAC305 Indium8.9HF
MD092H No-clean SnPb solder paste Sn63 NC-SMQ92J
MD064R Water-soluble SAC solder paste SAC305 Indium6.4R
MD064R Water-soluble SnPb solder paste Sn63 Indium6.4R