As a leader in soldering technology, Indium Corporation offers a number of solder pastes for Pb-free assembly. We offer many different alloy choices and flux technologies to solve many of your process challenges.
Indium Corporation’s Pb-free solder pastes are ideal for miniaturized components and fine-pitch assembly. They provide first-class printing and robust reflow performance and are all designed to AVOID THE VOID®.
As a leader in soldering technology, Indium Corporation has a variety of tried and true solder pastes for Pb-free circuit board assembly. Here are some additional solder pastes designed to help you with many of your soldering challenges.
Avoid the Void® Plus Exceptional In-Circuit Testing Performance with Indium8.9HF-1
Indium8.9HF-1 is specifically formulated to deliver outstanding voiding performance for bottom-terminated components (BTC) - plus a soft pliable flux residue post reflow, resulting in unprecedented in-circuit testing (ICT) and flying-probe testing first pass yields.
Enhanced ICT Performance:
Indium8.9HF-1 is a Pb-free, no-clean solder paste intended for both air and nitrogen reflow that produces:
Fewer false testing failures which equates to faster cycle times and less rework
Highest first-pass yields in ICT
Soft post-reflow flux residue
Halogen-free per EN14582 test method
Outstanding BTC voiding
High oxidation barrier eliminates graping and HiP defects
Provides a molten solder oxidation barrier
Improves coalescence of small deposits
Enhances electrical reliability (low activator)
Excellent print transfer efficiency
Bellcore and J-STD Tests & Results
Flux Type Classification
EN14582 Halogen Content
< 50ppm Br-
< 50ppm Cl-
Copper Mirror (JIS Z 3197)
Malcom Solder Paste Viscosity (10rpm)
1300 poise (typical)
Solder Ball Test
JIS Z 3197
Copper Mirror Plate Corrosion
Recommended Relow Profile
The stated profile recommendations apply to most Pb-free alloys in the SnAgCu (SAC) alloy system, including SAC305 (96.5Sn/3.0Ag/0.5Cu). This can be used as a general guideline in establishing a reflow profile when using Indium8.9HF-1 solder paste.
8.9HFA Solder Paste Delivers Superior Printing for Miniaturization
Leading Print Performance on Miniaturized Components
Indium8.9HFA is a versatile, halogen-free, Pb-free solder paste with leading print performance on miniaturized components.
Print performance is especially critical for manufacturers of mobile phones and other personal electronics devices, especially as they struggle with <8mil challenges associated with continuing miniaturization in the electronics assembly industry.
Indium8.9HFA Solder Paste provides:
Low Cost of Ownership & High Print Yields
Unsurpassed transfer efficiency for consistent, full volume print deposits (8 mil), results in reduced frequency of insufficients and high first-pass print yields
Low print pressure and excellent response-to-pause saves time and money on stencils and line changes
Solvent-free dry-wiping reduces costs
Higher print speed and reduced wipe frequency enables short cycle time, high up-time, and high throughput printing
Indium8.9HFA Solder Paste is part of Indium Corporation's Indium8.9 series of solder pastes. The series was designed to provide multi-faceted performance characteristics, bringing the right balance of solder paste attributes tailored specifically to your manufacturing process. Each paste in the series was developed to optimize print performance and mitigate common defects faced by manufacturers of personal electronics, such as QFN voiding, head-in-pillow, and graping.
Indium8.9HFA works best in applications that require:
Fine feature printing that present challenges for yields (area ratios <0.66); this includes most personal electronics applications
High speed printing applications (>100mm/second or >4 inches/second)
10.1 Solder Paste Best All-around Halogen-containing Paste
Leading Print Performance on Miniaturized Components
Indium Corporation’s Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
The oxidation-inhibiting properties of Indium10.1 solder pastes promote industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 solder paste makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations.
Indium10.1 solder paste enables the lowest cost of ownership to PCB assembly manufacturers through an all-around balanced performance in both high print and soldering yields. It boasts a versatile, well-balanced set of properties with best-in-class printing and soldering performance. Indium10.1 solder paste provides industry-leading print definition and transfer efficiency, low voiding performance, and head-in-pillow and graping resistance.
Indium10.1 Solder Paste is part of Indium Corporation’s family of high performance, lead-free solder pastes. The series was designed to provide multi-faceted performance characteristics, bringing the right balance of solder paste attributes tailored specifically to each specific manufacturing process. Each paste in the series was developed to optimize print performance and mitigate common defects faced by manufacturers of personal electronics, such as QFN voiding, head-in-pillow, and graping.
Indium10.8HF solder paste enables low cost-of-ownership to PCB assembly customers through an all-around balanced performance, including stencil printing yields, voiding, and soldering yields.
Indium10.8HF is versatile, with a balanced set of properties:
Meets leading OEM standards for
non-wet open resistance
Oxidation barrier technology delivers strong resistance to:
Graping (non-coalescence of powder particles)
Strong surface oxide cleaning and pad wetting during reflow ramp
Low voiding on BGSs, CSPs, and QFNs
Outstanding printing performance with high transfer efficiency and low variability
Indium10.8HF solder paste is best suited for applications with non-wet open induced defects. These are typically BGA microprocessors with thin core substrates and high IO counts that are found in PCs and tablets.