Avoid shortened product life; avoid field failures; avoid customer dissatisfaction, plus a whole lot more with Indium Corporation’s advanced solder paste technology.
Indium Corporation’s suite of solder pastes offers formulations designed to deliver low-voiding, plus enhanced benefits such as improved response-to-pause, stability, HiP minimization, reliable in-circuit testing, and enhanced SIR performance.
Indium8.9HF Solder Paste
Indium8.9HF Solder Paste provides consistent performance after room temperature or cold storage, and throughout the assembly process.
|<25°C||30 days max|
Room Temperature Stable
Indium10.1HF Solder Paste
Indium10.1HF Solder Paste minimizes solder beading and offers outstanding performance compared to the competitive material.
The solder beading test is designed to be a worst-case scenario and uses pad designs that aggravate solder beading.
|Solder Beading Test|
Indium8.9HF-1 Solder Paste
Indium8.9HF-1 Solder Paste provides industry-leading ICT probing first-pass yields due to the ease of probe penetration through the soft residue.
The following data represents an evaluation of Indium8.9HF-1 vs. four competitive materials in a production environment. Indium8.9HF-1 produced the best ICT First Pass Yield and exceptional printing First Pass Yield.
Indium10.1 Solder Paste
Indium10.1 Solder Paste virtually eliminates the head-in-pillow defect (HiP) with industry-leading oxidation barrier flux technology.