In a previous blog I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram.&nbs...

Posted On: April 4th, 2016 | By: Eric Bastow

High Temperature, Pb-free Die-Attach Material Project Webinars - iNEMI

On April 14th, iNEMI will host two webinars for the purpose of discussing a new project geared toward High Temperature, Pb-free Die Attach Materials....

Posted On: July 15th, 2015 | By: Indium Corporation®

Solder Technology Inside A Hot Car On A Sunny Summer Day

Here’s a true story regarding the service temperature of solder joints. Yesterday, as I left work, I noticed that it felt really hot outside. I ...

Posted On: June 15th, 2015 | By: Adam Murling

Changing the Composition of Your Tin-Lead Solder Pot

In today’s electronics manufacturing industry, many companies are using lead-free solder alloys. However, there are a few sectors in the industr...

Posted On: June 1st, 2015 | By: Dr. Ron Lasky

Lead Free 2015

Folks, It is hard to believe that in July we will celebrate the 9th anniversary of the advent of RoHS. So the timing seemed right when I was recently ...

Posted On: May 11th, 2015 | By: Dr. Ron Lasky

Pareto Chart Your Data to Help in Continuous Improvement

After a delightful lunch with Rob, Pete, and the Professor, Patty settled into her office to prepare a lecture on statistics. She was still enjo...

Posted On: April 8th, 2015 | By: Dr. Ron Lasky

Alloy Melting

Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our...

Posted On: April 6th, 2015 | By: Jim Hisert

Making Solder Preforms

Once an order is placed for the solder preforms that you have specified, Indium Corporation begins the manufacturing process promptly; we have a lot o...