As energy consumption has become increasingly important—in terms of cost, availability, and environmental impact—it is about time we use quantitative data to consider carbon emissions and oven energy consumption to make process decisions.
This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenient truth”: global warming is upon us, for real – not in the future, but right here, right now.
Shielding the RF waves generated by an MRI machine is mandatory. Soldered copper is one the metals used for RF shielding because it absorbs radio and other electromagnetic waves and easily conforms to any odd angles, while not requiring much maintenance.
As a leader in soldering technology, Indium Corporation offers a number of solder pastes for Pb-free assembly. We offer many different alloy choices and flux technologies to solve many of your process challenges.
Indium Corporation’s Pb-free solder pastes are ideal for miniaturized components and fine-pitch assembly. They provide first-class printing and robust reflow performance and are all designed to AVOID THE VOID®.
Over the last decade, the electronics industry has shifted to no-clean fluxes for surface mount assembly. Despite this industry trend, Indium Corporation has not only maintained a variety of water-soluble solder pastes and fluxes, but has revolutionized the category with the release of several new and versatile solder pastes. These solder pastes allow current water-wash manufacturing processes to not only survive, but to thrive.
Indium6.6HF is a new water-soluble halogen-free solder paste that is complementary with both Sn/Pb and Pb-free alloys. It is designed to provide exceptional printing performance and minimize voiding in PCB assembly applications. Indium6.6HF exhibits superior wetting to a variety of surface finishes resulting in the fewest number of voids, a reduction in the size of the largest void, and minimized overall voiding. Other benefits include:
Halogen-free per IEC 61249-2-21 test method EN14582
Exceptional printing process window:
High transfer efficiency
Long stencil life (up to 12 hours)
Prints consistently at a wide range of speeds
High tack value (>8 hours) ensures consistent component holding power, allowing high-speed component placement operation
RMA-155 Solder Paste for Military, Aviation, and Medical Applications
RMA-155 Solder Paste was designed to offer a balanced performance, making it ideal for high-complexity boards with a variety of component sizes. Compatible with both SnPb and SAC alloys, RMA-155 delivers consistent transfer efficiencies, excellent response-to-pause, and a strong oxidation barrier, even for long and hot profiles. It is halogen-free, resists graping (even on small components and tiny deposits), prevents head-in-pillow, and minimizes voiding for BGAs and large thermal planes (QFNs).
RMA-155 solder paste conforms to the RMA classification for QQ-S0571F and offers proven performance similar to our best-in-class, award-winning Pb-free solder pastes.
Additionally, Indium Corporation offers a full suite of compatible RMA materials, including:
Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.