Related Lead-Free Technical Papers
Whitepapers
A Drop-In Lead-Free Solder Replacement
Author(s): Dr. Ning-Cheng Lee, James Slattery, John R. Sovinsky
A Model Study of Profiling for Voiding Control at Lead-free Reflow Soldering
Author(s): Dr. Ning-Cheng Lee, Dr. Yan Liu
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via MN or CE Doping (English)
Author(s): Dr. Ning-Cheng Lee
Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping
Author(s): Dr. Ning-Cheng Lee, Dr. Ronald C. Lasky, Timothy Jensen
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly (Chinese)
Author(s): Indium Corporation
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly (English)
Author(s): Indium Corporation
BiAgX®: High-Temperature Lead-Free (Pb-free) Solder Paste
Author(s): Andy C. Mackie PhD, HongWen Zhang
Changing to Pb-free Profoundly Impacts the Manufacturing Production Process
Author(s): David Day
Engineering Solder Paste Performance Via Controlled Stress Rheology Analysis
Author(s): Dr. Ning-Cheng Lee
Future Lead-Free Solder Alloys and Fluxes-Meeting Challenges of Miniaturization
Author(s): Dr. Ning-Cheng Lee
High Technology Challenge: Assembling Today's Miniaturized Electronics Products
Author(s): Dr. Ronald C. Lasky
High-Reliability, High-Melting, Mixed Lead-Free BiAgX® Solder Paste System
Author(s): Dr. Ning-Cheng Lee, HongWen Zhang
Ionic Cleanliness Testing Research of Printed Wiring Boards for Purposes of Process Control
Author(s): Dr. Ning-Cheng Lee
Nano-Cu Sintering Paste for High-Power Devices Die-Attach Applications
Author(s): Dr. Ning-Cheng Lee, Min Yao
Reliability of BiAgX® Solder as a Drop-In Solution
Author(s): Dr. Ning-Cheng Lee, HongWen Zhang, Indium Corporation
Sealing the Gap of Solder Paste Technology in Lead-Free Halogen-Free Era
Author(s): Dr. Arnab Dasgupta, Dr. Ning-Cheng Lee, Dr. Yan Liu
Six Sigma® Techniques for Solder Paste Selection
Author(s): Dr. Ronald C. Lasky, Wang Ming
Solder Paste: Meeting The SMT Challenge
Author(s): Dr. Ning-Cheng Lee, Gregory Evans
The Superior Drop Test Performance of SAC-Ti Solders and Its Mechanism
Author(s): Dr. Ning-Cheng Lee, Paul Bachorik
Through-Hole Assembly Options for Mixed Technology Boards
Author(s): Dr. Ronald C. Lasky, Ross B. Berntson
Tin-Silver Bismuth: A Better Lead-Free Alternative?
Author(s): Indium Corporation
Voiding of Lead-Free Soldering at Microvia
Author(s): Dr. Hyoryoon Jo, Dr. Ning-Cheng Lee
Product Data Sheets
- Indium10.1HF Ultra-Low Voiding Pb-Free Solder Paste (US Letter) (A4)
- Indium3.2 Pb-Free Water-Soluble Solder Paste (US Letter) (A4)
- Indium3.2HF Water-Soluble Solder Paste (US Letter) (A4)
- Indium5.8LS Pb-Free Solder Paste (US Letter) (A4)
- Indium8.9 Pb-Free Solder Paste (A4)
- Indium8.9HF Pb-Free Solder Paste (US Letter) (A4)
- Indium8.9HF SnPb Solder Paste (US Letter) (A4)
- Indium8.9HF-1 Pb-Free Solder Paste (US Letter) (A4)
- Indium8.9HFA Pb-Free Solder Paste (US Letter) (A4)
- Indium9.0A Pb-Free Solder Paste (US Letter) (A4)